Common mode filters (CMF) are widely used to ensure signal integrity. However, due the large area, traditional CMFs cannot meet eager demand for miniaturization of modern communication systems. In this paper, a three-dimensional integrated CMF based on through silicon vias (TSV) technology is proposed. The adoption TSV greatly reduces area CMF. structure modeled and simulated by HFSS software. ...

Inkjet printing is an attractive deposition tool to complement the traditional processing methods used in microelectronics integration. Its maskless, digital and non-contact nature provides many generic benefits, such as savings in processing steps and material usage, production flexibility and scalability to large areas. In addition, inkjet printing can be utilized in the integration of e.g. s...

In this paper we optimize the back-to-front overlay of Through Silicon Via (TSV) patterning for a 5μm via last process. After TSV patterning, overlay verification poses a challenge because the reference layer is buried underneath the thinned silicon wafer. For both back-to-front alignment and verification a wafer stepper equipped with a Dual Side Alignment (DSA) system is used. The stepper has ...

Abstract To increase the light collection efficiency of a liquid Ar (LAr) detector, we optimized evaporation technique tetraphenyl butadiene (TPB) on detector surface and tested operability silicon photomultiplier (SiPM), namely, multi-pixel photon counter with through-silicon-via (TSV–MPPC, Hamamatsu Photonics K.K.) at LAr temperature. TPB converts scintillations (vacuum ultraviolet light) to ...

h THREE-DIMENSIONAL INTEGRATION, a breakthrough technology to achieve “More Moore and More Than Moore,” provides numerous benefits such as better performance, lower power consumption, smaller form factor, and wider bandwidth than traditional 2-D integration technology. Three-dimensional stacking of heterogeneous silicon layers also enables heterogeneous 3-D integration. Thanks to the enormous e...

There has been a tremendous research effort in recent years to move DC-DC converters on chip for enhanced performance. However, a major limiting factor to implement on-chip inductive DC-DC converters is the large area overhead induced by spiral inductors. Towards this, we propose to use through-silicon-vias (TSVs), a critical enabling technique in three-dimensional (3D) integrated systems, to i...

Tityus serrulatus scorpion venom (TSV) consists of a very complex mixture of molecules and demonstrates significant immunomodulatory activities capable of stimulating immune functions in vivo. The purpose of this study was to compare the crude TSV with fractionated toxins extracted from this venom in order to determine which toxin(s) presented immunomodulatory effects on peritoneal macrophages....