Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This pape...

THE deposition of organic semiconductors, e.g. Pentacene (C22H12) and Alq31, becomes more and more important. Due to lower process temperatures, the manufacturing of organic electronic devices such as light emitting diodes (OLEDs) and thin film transistors (OTFTs) is less energy consuming. Additionally, these low temperatures also make it possible to use flexible substrates, e.g. plastic films,...

The Casimir force, originating from vacuum zero-point energy, is one of the most intriguing purely quantum effects. It has attracted renewed interests in current field of nanomechanics, due to the rapid size decrease of on-chip devices. Here we study the optomechanically-induced transparency (OMIT) with a tunable Casimir force. We find that the optical output rate can be significantly altered b...

Gallium and aluminum co-doped zinc oxide (GAZO) films were produced by magnetron sputtering. The GAZO films were post-annealed in either vacuum or hydrogen microwave plasma. Vacuum- and hydrogen microwave plasma-annealed GAZO films show different surface morphologies and lattice structures. The surface roughness and the spacing between adjacent (002) planes decrease; grain growth occurs for the...

A charged superconductiong cosmic string produces an extremely large electric field in its vicinity. This leads to vacuum instability and to the formation of a charged vacuum condensate which screens the electric charge of the string. We analyze the structure of this condensate using the ThomasFermi method. PACS number(s): 98.80.Cq Electronic Address: [email protected]. tufts.edu Electronic ...

The conceptual design of the vacuum system for the upgrade project of SPEAR3 is reviewed. The majority of the vacuum system components, except for insertion devices, will be replaced with components capable of 500 mA operation at 3 GeV. General requirements and overall layout of the vacuum system are discussed. Diagnostic chambers and speciality components are briefly discussed.