Thinned silicon chips with very thin bumps (5-7μm) mounted on flexible substrates open up new dimensions in packaging technologies. The use of flexible substrates enables a large variety of geometric possibilities including folding and bending. Conventional flip chip technology using pick&place and standard reflow processes is not suitable for the assembly of ultra thin components. This is base...

(This is part 2, continued from “Use of harsh Wafer Probing to Evaluate Traditional Bond Pad Structures”). Goals for circuit under pad (CUP) in aluminum – silicon dioxide (Al – SiO2) based IC pad structures include the design of metal interconnects in all layers beneath the pad Al, and the ability to withstand harsh probing and wirebonding stress without SiO2 cracking, without deforming or bend...

this research is carried out to design and manufacturing of lathe vibration tool and their tests. firstly, one-dimensional vibration tool is designed and made of the bending vibration mode. one-dimensional vibration tool with half piezoelectric rings is considered to excite the bending mode of tool. structure of vibration tool is designed in abaqus software about 20 khz and then is made with re...

The design of automatic layout algorithms for single graphs is a well established field, and some recent studies show how these algorithms affect human understanding. By contrast, layout algorithms for graphs that change over time are relatively immature, and few studies exist to evaluate their effectiveness empirically. This paper presents two new dynamic graph layout algorithms and empirical ...

The spline finite strip method (S.F.S.M.) for buckling analysis of plates and plate assemblies subjected to longitudinal compression and bending, transverse compression as well as shear is described. The method allows for the boundary conditions. Local buckling coefficients of plates with different boundary conditions under compression, bending and shear are calculated. Convergence studies with...

Automatic layout analysis has proven to be extremely important in the process of digitization of large amounts of documents. In this paper we present a mixed approach to layout analysis, introducing a SVM-aided layout segmentation process and a classification process based on local and geometrical features. The final output of the automatic analysis algorithm is a complete and structured annota...