Recently deep submicron and SiGe (silicongermanium) bipolar CMOS technologies have enhanced the performance of Si-based radio frequency (RF) integrated circuits up to microwave frequencies. The integration of RF MEMS components, such as inductors and capacitors, could further improve the performance of key RF circuit blocks such as voltage controlled oscillators (VCO), low-noise amplifiers, fil...

This paper formulates various quality ( ) factors associated with the applications of on-chip spiral inductors to radiofrequency integrated circuits using -parameters. The formulations start with the factor of a spiral inductor in a generalized two-port configuration based on a new complex-power approach and then extend to the factors of a tank and matching circuits that use the spiral inductor...

This paper includes investigations of power losses in monolithic buck dc-dc converter designed with Cadence on CMOS 0.35 μm process. Input voltage of the designed circuit is equal to 3.6 V and output voltage is regulated to 1.2 V. Evaluated and estimated are power dissipations in the MOS transistor, filter inductor and filter capacitor of the buck converter. Investigated and compared are losses...

Extensive experimental results and detailed investigations of the performance of on-chip circular double-spiral stacked inductors on silicon substrates are presented. Based on a proposed equivalent circuit model and measured S-parameters using the de-embedding technique, the inductance L, resonant frequency fres, Q-factor, coupling capacitance between the upper and lower spirals, and oxide capa...

This paper describes three micromachined planar inductors (a spiral type, a solenoid type, and a toroidal meander type) with electroplated nickel–iron permalloy cores which have been realized on a silicon wafer using micromachining techniques. The electrical properties among the fabricated inductors are compared and the related fabrication issues are discussed, with emphasis on the low-temperat...

Inductors are a necessary building block in many circuits, including LNA and oscillators largely used in Receivers and various other systems. Because planer inductors can occupy a large amount of area in integrated-circuit (IC) designs, the search has been on for smaller, tunable inductors suitable for monolithic fabrication In this paper a method, which is to implement an active inductor by CM...

A new method for predicting the stray capacitance of inductors is presented. The method is based on an analytical approach and the physical structure of inductors. The inductor winding is partitioned into basic cells—many of which are identical. An expression for the equivalent capacitance of the basic cell is derived. Using this expression, the stray capacitance is found for both singleand mul...

While previous studies on substrate coupling focused mostly on noise induced through drain-bulk capacitance, substrate coupling from planar spiral inductors at radio frequency (RF) via the oxide capacitance has not been reported. This paper presents the experimental and simulation results of substrate noise induced through planar inductors. Experimental and simulation results reveal that isolat...

A silicon micromachining method has been developed to fabricate on-chip high-performance suspended spiral inductors. The spiral structure of an inductor was formed with polysilicon and was suspended over a 30m-deep cavity in the silicon substrate beneath. Copper (Cu) was electrolessly plated onto the polysilicon spiral to achieve low resistance. The Cu plating process also metallized the inner ...

It is well known that a °oating inductor circuit is realized from a grounded inductor circuit by replacing the operational ampli ̄er by a °oating operational transconductance ampli ̄er. This idea is extended to transform current conveyor grounded inductors to °oating inductors by replacing the current conveyor by the recently introduced °oating current conveyor. Several examples are considered an...