نتایج جستجو برای: cyclic void growth model

تعداد نتایج: 2898671  

Journal: :Journal of Computational Science and Technology 2013

2006
V. A. Lubarda X. Markenscoff

Stress magnification in thin ligaments between small and large cylindrical voids is obtained by matching the inner field approximation by beam theory to the outer rigid-body field in the bulk of the material. A void between two larger voids is modeled as a large hole within a strip of straight edges (boundaries of the holes with infinite radii of curvature). Both stretching and bending types of...

Journal: :Materials Letters 2021

The effect of edge dislocations, impinging on grain boundary in fcc Fe near a preexisting void the volume this void, was studied using MD simulation. It found that virtually unlimited growth via mechanism is possible under certain conditions. To best our knowledge first atomistic simulation study, demonstrating feasibility mechanism.

2018
Pierre-Guy Vincent Yann Monerie Pierre Suquet

This study is devoted to the mechanical behavior of polycrystalline materials with two populations of voids, small spherical voids located inside the grains and larger spheroidal voids located at the grain boundaries. In part I of the work, instantaneous effective stress-strain relations were derived for fixed microstructure. In this second part, the evolution of the microstructure is addressed...

Journal: :Computer methods in biomechanics and biomedical engineering 2017
Naiara Rodriguez-Florez Alessandra Carriero Sandra J Shefelbine

This study aimed at using eXtended finite element method (XFEM) to characterize crack growth through bone's intra-cortical pores. Two techniques were compared using Abaqus: (1) void material properties were assigned to pores; (2) multiple enrichment regions with independent crack-growth possibilities were employed. Both were applied to 2D models of transverse images of mouse bone with differing...

P.C Gope, R.K Bhagat V.K Singh,

In this paper, the present investigation has been conducted keeping in mind some of the problems concerning the crack propagation direction and growth under constant loading in an inclined crack geometry. The present studies mainly focused on the development and modifications in the crack growth criterion to account the biaxial, shear loading and number of stress terms. Existing criteria for th...

2004
L. J. Gray

A primary cause of failure in microelectronic devices is void growth and movement in aluminum wire interconnects. In addition to thermal and mechanical stress, void evolution is driven by the electric field in the wire. Two new boundary element techniques, approximate Green's functions and Galerkin surface derivative evaluation, have been developed to assist in modeling the electromigration pro...

2016
Hwang-Hee Kim Chun-Soo Kim Ji-Hong Jeon Chan-Gi Park

To evaluate the effects of industrial by-products materials on the performance of porous concrete for plant growth, this study investigated the physical, strength, and freeze/thaw resistances of porous concrete for plant growth, prepared by replacing cement with blast furnace slag powder at 60% by weight, and replacing natural stone aggregates with coarse blast furnace slag aggregates at rates ...

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