Article history: Received 2 May 2015 Received in revised form 10 October 2015 Accepted 27 November 2015 Available online 28 November 2015 Load-bearing laminated structures undergo complex crack evolution processes and consequent stiffness degradation, which leads to a decline in their overall performance. Thus, consideration of damage evolution is important for stiffness critical applications. ...

• We propose an analytical model to predict sub-surface damage during the grinding of silicon. The is based on theory dislocation kinetics and fracture mechanics. also considers strain rate effects in predicting deformation. was experimentally validated further optimize This paper proposes for grinding-induced depth a silicon wafer. integrates crack initiation mechanics propagation first time. ...