Copper electroless plating at low pH (7–9) using dimethylamine borane complex as a reducing agent is studied electrochemically by linear sweep voltammetry, cyclic voltammetry and chronopotentiometry in full electrolytes. We find that the mixed potential theory is not applicable to the described system. We show that both the working potential and the rate-controlling mechanism are dependent on t...

Well-defined monohydride-terminated n-Si(111) electrodes were used to study electrodeposition of Pb and Cu as well as electroless Au deposition on these surfaces. With classical electrochemical methods, in-situ STM, ex-situ AFM, SEM and in-situ SXRD, the initial stages of metal deposition and the epitaxial properties of the metal deposit were investigated. © 2000 Elsevier Science Ltd. All right...

A driving force to achieve increased speed and performance along with higher I/O count is the Flip Chip (FC) Technology which has therefore an high level of importance for a variety of applications. A breakthrough, however, will be the use of flip chip due to cost reduction. For this aim it is essential to use low cost bumping techniques. This paper shows a low cost wafer level bumping process ...

Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM) and X-ray ...

An electroless deposition method comprised of seed formation and subsequent seeded growth is developed for the decoration of surface-grown single-walled carbon nanotubes (SWCNTs) with gold nanoparticles of controlled size and interparticle distance. The density of the gold nanoparticles is determined by the density of seeds. Gold seeds are used for the SWCNT arrays grown on SiO(x)/Si substrates...

A novel approach for direct electroless (EL) patterning of copper films without catalysts has been developed. In a special electroless solution employed in the present study, the formation of copper particles was observed and the negatively charged surfaces were confirmed by zeta potential measurements. The conditions of the solution (ionic strength, pH, temperature, additives etc.) greatly aff...

In this work, a new mechanism is proposed for the redox of hypophosphorous acid catalyzed by a nickel cluster through a combined study of density functional theory (DFT) calculations and electrochemical impedance spectroscopy (EIS) measurements. The DFT results indicate that the concentration of OH is a crucial species to control the oxidation and reduction of hypophosphorous acid. The oxidatio...

Electrophysiological Sensors In article number 2200342, Ryan Kaveh, Ana C. Arias, and co-workers present a fabrication method for rapidly producing low impedance, anatomically fit dry electrodes that do not require hydrogels. By using electroless copper gold plating with 3D printing, biocompatible can be optimized individuals at fraction of the cost existing vacuum deposition-based techniques.