The viscosity of the Zr46.75Ti8.25Cu7.5Ni10Be27.5 bulk metallic glass forming alloy in the supercooled liquid was measured using parallel plate rheometry. The measurements were carried out with different heating rates between 0.0167 and 1.167 K/s as well as isothermally. Because of the high thermal stability above the glass transition of this bulk metallic glass former with respect to crystalli...

The ultrasensitive differential scanning calorimetry is used to observe the glass transition in thin (1-400 nm) spin-cast films of polystyrene, poly (2-vinyl pyridine) and poly (methyl methacrylate) on a platinum surface. A pronounced glass transition is observed even at a thickness as small as 1-3 nm. Using the high heating (20-200 K/ms) and cooling (1-2 K/ms in glass transition region) rates ...

Pressure dependknce of XAC (T) for amorphous Fe,Laloo-, has been measured up to 20 kbar. With increasing pressure, the ferromagnetic phase for x = 87.5 reduces and finally the spin-glass state is realized below 110 K. Paramagnetic to spin-glass transition temperature observed for x = 92.5 becomes low by applying pressure. Spin-glass behavior has been observed in Fe-rich amorphous alloy systems ...

Recently it has been revealed that when approaching the glass-transition temperature, T(g), the dynamics of a liquid not only drastically slows down, but also becomes progressively more heterogeneous. From our simulations and experiments of six different glass-forming liquids, we find that the heterogeneous dynamics is a result of critical-like fluctuations of static structural order, contrary ...

Facilitated spin models were introduced some decades ago to mimic systems characterized by a glass transition. Recent developments have shown that a class of facilitated spin models is also able to reproduce characteristic signatures of the structural relaxation properties of glass-forming liquids. While the equilibrium phase diagram of these models can be calculated analytically, the dynamics ...

In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. These residual stresses add up to the st...

With sufficient high cooling rates, a variety of liquids, including metallic melts, will cross a glass transition temperature and solidify into glass accompanying a marked increase of the shear viscosity in approximately 17 orders of magnitude. Because of the intricate atomic structure and dynamic behaviours of liquid, it is yet difficult to capture the underlying structural mechanism responsib...