[1] We compute the dissipation due to the drag of falling raindrops and cloud droplets, and find both to be significant sources of dissipation on Earth and possibly Titan. On other planets, they appear to be insignificant. We compare this dissipation with the latent heat transported by the drops and the thermodynamic efficiency with which it can be converted into work. This comparison suggests ...

The possibility of building a high voltage electrostatic air pump for cooling of microelectronics is investigated. Existing cooling technology no longer provides adequate heat dissipation due to excessive heat generation caused by the growing component density on electronic devices. Heat sink fins are packed more closely to increase the heat exchange surface area, resulting in narrower channels...

We describe a new variant of the MBO scheme for solving the semi-supervised data classification problem on a weighted graph. The scheme is based on the minimization of the graph heat content energy. The resulting algorithms guarantee dissipation of the graph heat content energy for an extremely wide class of weight matrices. As a result our method is both flexible and unconditionally stable. Ex...

After processing, the semiconductor material is cleaved into comparatively small pieces of 1.2mm by 1.4mm. These laser chips contain the important sorting cell as well as two neighboring cells to enable an easier handling of the chip and thus a protection of the lasers. However, due to the small dimensions of the laser chip, there was poor heat dissipation and consequently elevated temperatures...

To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26oC. Results show that the temperature of the substrate of LEDs reaches 62oC without the fan, however, it reaches only 32oC when the best cooling condition appears. The temper...

With the continued increase in power dissipation and power density of high-performance microprocessors, as well as requirements for high-density packaging and lower device junction temperatures, improvements of electronic cooling technologies have been becoming strategically important in the challenge of advanced thermal solutions for achieving higher cooling efficiencies while meeting reliabil...

The thermal properties such as specific heat capacity and heat dissipation of peloids play an important role in therapeutic applications. Therefore, these properties were determined on the peloids samples taken from spas where peloid applications are used in Turkey. In addition, some pure clay minerals were investigated to determine their suitability as possible constituents of therapeutic pelo...

CURRENT THEORIES OF DISSIPATION IN THE RELATIVISTIC REGIME SUFFER FROM ONE OF TWO DEFICITS: either their dissipation is not causal or no profiles for strong shock waves exist. This paper proposes a relativistic Navier-Stokes-Fourier-type viscosity and heat conduction tensor such that the resulting second-order system of partial differential equations for the fluid dynamics of pure radiation is ...

Combining entransy theory with constructal theory, this mini-review paper summarizes the constructal optimization work of heat conduction, convective heat transfer, and mass transfer problems during the authors’ working time in the Naval University of Engineering. The entransy dissipation extremum principle (EDEP) is applied in constructal optimizations, and this paper is divided into three par...

Article history: Received 8 November 2015 Received in revised form 1 March 2016 Accepted 4 March 2016 Available online 5 March 2016 Although thermal-aware Through Silicon Via (TSV) cluster's behavior has been studied extensively, the structure of TSV cluster,which is also critical for heat dissipation in ThreeDimensional IntegratedCircuit (3D IC), is ignored. In this paper, a novel structure of...