نتایج جستجو برای: intermetallic growth
تعداد نتایج: 821566 فیلتر نتایج به سال:
The reliability of portable electronic devices was studied by applying standardized test procedures for test vehicles that represent the technologies and lead-free materials typically used in novel portable products. Thermal cycling and drop testing are commonly used because they reveal the failure modes and mechanisms that portable devices experience in operational environments. A large number...
In situ X-ray photoelectron spectroscopy (in situ XPS) was used to study the structural and catalytic properties of Pd-In near-surface intermetallic phases in correlation with previously studied PdZn and PdGa.Room temperature deposition of ∼4 monolayer equivalents (MLEs) of In metal on Pd foil and subsequent annealing to 453 K in vacuum yields a ∼1:1 Pd/In near-surface multilayer intermetallic ...
Metallic-intermetallic laminate (MIL) composites are promising materials for structural applications especially in the aerospace industry. One of the interesting laminate composites is the Ti-TiAl 3 multilayer. In this work, commercially pure sheets of aluminum and titanium with almost equal thickness of around 0.5 mm were explosively joined. The achieved multilayers were annealed at 630 ℃in di...
Low-temperature intermetallic compound (lMC) growth in hot-air-leveled tin (HALT) at lower temperatures was investigated. A technique based on image analysis of backscatter electron scanning electron microscopy images was used to measure the average thickness of Cu-Sn IMC in HALT at 50°C, 75°C, and 100°C with a high degree of precision. The technique made it possible to observe new features of ...
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