Silex Microsystems, a pure play MEMS foundry, offers a high density through silicon via technology that enables MEMS designs with significantly reduced form factor. The Through Silicon Via (TSV) process developed by Silex offers sub 50 μm pitch for through wafer connections in up to 600 μm thick substrates. Silex via process enables “all silicon” MEMS designs and true "Wafer Level Packaging" fe...

Micromachining and micro-electromechanical system (MEMS) technologies can be used to produce complex structures, devices and systems on the scale of micrometers. Initially micromachining techniques were borrowed directly from the integrated circuit (IC) industry, but now many unique MEMS-specific micromachining processes are being developed. In MEMS, a wide variety of transduction mechanisms ca...

purpose : the aim of this study was to compare the rate and location of intraoperatively induced retinal breaks between two techniques of standard 20-gauge vitrectomy and transconjunctival 23-gauge using trocar/cannula methods : in this prospective comparative case series patients having attached retina before surgery who were operated for different vitreoretinal or macular conditions by standa...

The accurate value of thermal expansion coefficient ( ) of thin film is an important thermal property in the design of microelectronic devices and microsystem. This research presents a microbridge buckling deformation caused by the residual stresses to determine the of thermal oxide (SiO2) film. The extraction of is supported through experimental means and finite element analysis (FEM) of the b...

Micro bearing systems for Micro Electromechanical Systems (MEMS) have drawn attention for several decades as critical components for micro rotating machinery. Ideally, frictionless bearings are needed, and in practice, micro gas bearings approach the ideal. Typically, bearings function as a separate component, assembled onto sliding counterparts. However, in micro scale devices, assembly proced...

RF/microwave MEMS technology. Part one begins with a brief discussion of RF/microwave system requirements, and then introduces the enabling potentialities of the MEMS arsenal to meet these requirements. In particular, MEMS fabrication techniques are addressed, and fundamental components, including inductors, varactors, resonators and transmission lines, as well as the design/ CAD paradigm, are ...

MEMS components by their very nature have different and unique failure mechanisms than their macroscopic counterparts. This paper discusses failure mechanisms observed in various MEMS components and technologies. MEMS devices fabricated using bulk and surface micromachining process technologies are emphasized.