Article history: Received 25 May 2015 Received in revised form 27 June 2015 Accepted 2 July 2015 Available online xxxx

Abstract Forced convective pin-fin heat exchangers, due to the high wet surface area per volume and hindered thermal boundary layers, feature low resistances. However, considerable coolant pressure drop, particularly for densely packed fin arrays, imposes operational costs pumping power supply. This paper develops a multi-objective topology optimization approach optimize sink geometries in orde...

This paper deals with the thermal reliability optimization of a pin fin heat sink (HS) filled phase change material (PCM) in order to study transfer performance for cooling electronic devices. Aluminium is taken carry out constant volume fraction 9% by choosing 72 fins. Paraffin wax used as PCM inside retain produced device. A reliability-based design (RBDO) addressed determine optimum configur...