Article history: Received 25 April 2016 Received in revised form 26 June 2016 Accepted 29 July 2016 Available online 10 August 2016 The purpose of this paper is to analyze and predict the thermal deformation of the through silicon via (TSV) interposer package during themanufacturing process and to perform a parametric study to minimize thewarpage and thermal stress. Samples were selected during...

In this study, nonlinear bending of solid and annular functionally graded (FG) sector plates subjected to transverse mechanical loading and thermal gradient along the thickness direction is investigated. Material properties are varied continuously along the plate thickness according to power-law distribution of the volume fraction of the constituents. According to von-Karman relation for large ...

Thermoelastic behavior of temperature-dependent (TD) and independent (TID) functionally graded variable thickness cantilever beam subjected to mechanical and thermal loadings is studied based on shear deformation theory using a semi-analytical method. Loading is composed of a transverse distributed force, a longitudinal distributed temperature field due to steady-state heat conduction from root...

The dissipated energy from periodic deformation is regarded as the main reason for heat generation and temperature rise inside the tire domain. However, the mechanical behavior of rubber parts is highly temperature dependent. In most performed investigations, the influence of thermal effects on stress/ deformation fields of pneumatic tires is ignored and just temperature distribution is conside...

Different types of dislocation bundles were identified in the (001) GaAs substrates of III–V heterostructures. Comparisons of scanning infrared polariscopy images and X-ray transmission topograms showed a one to one correlation of stripes of reduced residual shear strain and dislocation bundles of the majority type. Visible-light interferometry and Makyoh topography, on the other hand, showed a...