نتایج جستجو برای: thermal resistance measurement

تعداد نتایج: 1003814  

2014
Tae Sup Yun Yeon Jong Jeong Kwang-Soo Youm

The accurate assessment of the thermal conductivity of concretes is an important part of building design in terms of thermal efficiency and thermal performance of materials at various temperatures. We present an experimental assessment of the thermal conductivity of five thermally insulated concrete specimens made using lightweight aggregates and glass bubbles in place of normal aggregates. Fou...

Ceramic borides, carbides and nitrides with high melting point, relatively good resistance to oxidation and corrosive environments are considered by many researchers in various high temperature industries, which is known from the family of materials as high temperature ceramic (UHTC). To be. All UHTCs have very strong bonds that give them structural stability at high temperatures, and among the...

Journal: :Quarterly of Applied Mathematics 1961

Journal: :Tekstil Ve Konfeksiyon 2021

Skin models are used for determination of water and thermal resistance fabrics. Measurement in these instruments starts with vapour a boundary layer above the sweating hotplate. In second step, hotplate is covered by tested fabrics instrument measures WV fabric that layer. Afterwards, difference between measurements presents required measured fabric, provided both identical. However, surface ro...

Journal: :The Review of scientific instruments 2013
Jun Liu Jie Zhu Miao Tian Xiaokun Gu Aaron Schmidt Ronggui Yang

The increasing interest in the extraordinary thermal properties of nanostructures has led to the development of various measurement techniques. Transient thermoreflectance method has emerged as a reliable measurement technique for thermal conductivity of thin films. In this method, the determination of thermal conductivity usually relies much on the accuracy of heat capacity input. For new nano...

2016
Jungwan Cho Zijian Li Mehdi Asheghi Kenneth E. Goodson

The thermal management challenge posed by gallium nitride (GaN) high-electron-mobility transistor (HEMT) technology has received much attention in the past decade. The peak amplification power density of these devices is limited by heat transfer at the device, substrate, package, and system levels. Thermal resistances within micrometers of the transistor junction can limit efficient heat spread...

2015
Benjamin Rosenzweig Alparslan Oztekin

............................................................................................................................. 1 Chapter 1: Introduction .................................................................................................... 2 1.1 Motivation ............................................................................................................................. 2...

2012
HSINYI LO

A tool for evaluating thin-film thermal conductivity to submicron spatial resolution has been developed. The micro-instrumentation utilizes the thermoreflectance (TR) technique to characterize thermal conductivity and material uniformity. The instrument consists of a heating element for creating temperature gradients and an Invar bar with in situ temperature monitoring for heat flux measurement...

2014
Edwin Okoampa Boadu Yuan Lin

Copper-Graphite laminate material design has been analysed, and this proposed composite has the ability to enhance heat dispersing more efficiently compared to the traditional high thermal conductivity with weight associated copper and high thermal resistance graphite. A finite element analysis (FEA) is carried out using the material (Cu – Gr) properties to investigate this proof. The design, t...

2013
Dengjian Li Weiguo Li Dingyu Li Yushan Shi Daining Fang

The thermal shock resistance of ceramics depends on not only the mechanical and thermal properties of materials, but also the external constraint and thermal condition. So, in order to study the actual situation in its service process, a temperature-dependent thermal shock resistance model for ultra-high temperature ceramics considering the effects of the thermal environment and external constr...

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