Aluminum reinforced by 60 vol.% diamond particles has been investigated as a potential heat sink material for high power electronics. Diamond (CD) is used as reinforcement contributing its high thermal conductivity (TC 1000 W mK ) and low coefficient thermal expansion (CTE 1 ppm K ). An Al matrix enables shaping and joining of the composite components. Interface bonding is improved by limited c...

Elevated thermal stresses and deformations can result in a mechanical (structural), as well as in a functional (electrical or optical), failure of an electronic or photonic material, structure or package. Predictive modeling, whether analytical (“mathematical”) or numerical (typically, Finite Element), is an effective research/engineering tool for the prediction of the level and the adverse con...

The kinetics and channels of laser energy redistribution in a target irradiated by a short, 1 ps, laser pulse is investigated in computer simulations performed with a model that combines molecular dynamics (MD) simulations with a continuum description of the laser excitation and relaxation of the conduction band electrons, based on the two-temperature model (TTM). The energy transferred from th...

A novel concept of determining optimized cooling protocols for freezing three-dimensional organs has been developed and its feasibility examined computationally. The concept is based on determining correct spatial variation of temperature distribution on the walls of a freezing container at every instant of time during the cooling process so that local thermal stresses in the heterogeneous orga...