نتایج جستجو برای: through studying

تعداد نتایج: 1446812  

Journal: :E3S web of conferences 2021

Cold-climate variable-capacity air-to-air heat pumps (VCHPs) have the potential to significantly reduce energy use in Canadian residential sector. However, optimizing their integration climate can be a challenge, with efficiency and operating behaviour heavily dependent on ambient conditions, building thermal loads, modulating capability units’ individual performance characteristics. Better und...

2015
Dan Wang Fengqiu Zhu Xiaoli Zhu Shixue Zheng Rui Wang Gejiao Wang

Paenirhodobacter enshiensis is a non-photosynthetic species that belongs to family Rhodobacteraceae. Here we report the draft genome sequence of Paenirhodobacter enshiensis DW2-9(T) and comparison results to the available related genomes. The strain has a 3.4 Mbp genome sequence with G + C content of 66.82 % and 2781 protein-coding genes. It lacks photosynthetic gene clusters and putative prote...

2014
Brandon Noia

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

2014
Andrew C. Smith

Narratives abound concerning the religious and political positioning of Jerusalem in the past as well as the present and have been used in a variety of ways to serve various ideologies or political ends. One such narrative (which can be found even in some academic treatises of the history of Jerusalem) states that following the Muslim re-conquest of the city after the Crusades Muslim rulers neg...

Journal: :Microelectronics Reliability 2013
T. Frank Stéphane Moreau C. Chappaz Patrick Leduc Lucile Arnaud Aurélie Thuaire E. Chery F. Lorut L. Anghel Gilles Poupon

0026-2714/$ see front matter 2012 Elsevier Ltd. A http://dx.doi.org/10.1016/j.microrel.2012.06.021 ⇑ Corresponding author at: STMicroelectronics, 8 Crolles, France. Tel.: +33 4 38 92 27 30. E-mail address: [email protected] (T. Frank). In this paper, reliability of Through Silicon via (TSV) interconnects is analyzed for two technologies. First part presents an exhaustive analysis of Cu TSV-la...

2013
Xin Fan Georg Essl

We show how body-centric sensing can be integrated in musical interface to enable more flexible gestural control. We present a barehanded body-centric interaction paradigm where users are able to interact in a spontaneous way through performing gestures. The paradigm employs a wearable camera and see-through display to enable flexible interaction in the 3D space. We designed and implemented a p...

Journal: :IJMTM 2007
Nikhi J. Churi Z. J. Pei Dustin C. Shorter Clyde Treadwell

Silicon carbide (SiC) has found a variety of engineering applications due to its superior properties. However, it is still desirable to study cost-effective processes to machine silicon carbide. This paper presents the results of a designed experimental investigation into Rotary Ultrasonic Machining (RUM) of silicon carbide. A four-variable two-level full factorial design was employed to reveal...

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