Composite materials, especially polymer matrix composites, have been intensively studied for energy absorption applications. When the temperature is close to or higher than the glass transition temperature (Tg), the polymer matrix is usually viscoelastic. With an external loading, either dynamic or quasi-static, the relaxation of the network polymer chains would cause a considerable energy diss...

• Self-anchored prestressed CFRP plates without the need for mechanical end anchorage. Significant improvement in bending stiffness, crack width, and load-carrying capacity. Nonlinear finite element analyses of flexural cracks crack-induced debonding plates. This paper presents an innovative method prestressing carbon fibre reinforced polymer (CFRP) used as externally bonded reinforcement stren...

The implementation of a sandwich panel on the marine structure needs better knowledge mechanical behaviour, primarily static and dynamic response. response is investigated due to application ferry ro-ro ramp door using finite element software ABAQUS. Five modification models different thickness stiffener configuration were compared analysis analyze comparison structural strength weight saving. ...

A multi-level analysis of skin/stiffener debonding is used to perform the design of fuselage of future aircraft during postbuckling. The “pyramid of test” approach is used both for experimental and numerical analysis (see Fig 1). The analysis begins with nonspecific element (NASA Specimens), then 7 point-bending tests are performed and the approach is finally validated on real panels of an on-g...

Concrete-epoxy interface can be found in many strengthened or retrofitted structures, especially in Hong Kong where concrete structures are the majority. In practice, epoxy is usually used in repairing concrete structures because of its excellent adhesion, chemical and heat resistance, good mechanical properties and electrical insulating properties. The bond between concrete and epoxy has been ...

Peel-and-stick process, or water-assisted transfer printing (WTP), represents an emerging process for transferring fully fabricated thin-film electronic devices with high yield and fidelity from a SiO2/Si wafer to various non-Si based substrates, including papers, plastics and polymers. This study illustrates that the fundamental working principle of the peel-and-stick process is based on the w...