نتایج جستجو برای: cooling load
تعداد نتایج: 200733 فیلتر نتایج به سال:
Energy piles are an effective and economic means of using geothermal energy resources for heating and cooling buildings, contributing to legislative requirements for renewable energy in new construction. While such piles have been used for around 25 years with no apparent detrimental effect, there is limited understanding of their thermo-mechanical behaviour. This paper synthesises the results ...
Dielectric mirror leakage at large angles of incidence limits the effectiveness of solid state optical refrigerators due to reheating caused by photon absorption in an attached load. In this paper, we present several thermally conductive link solutions to greatly reduce the net photon absorption. The Los Alamos Solid State Optical Refrigerator(LASSOR) has demonstrated cooling of a Yb+ doped ZBL...
For the first time, optical cooling has been observed in the (4)I(13/2) excited state of erbium(III), using the low phonon energy host materal, potassium lead chloride (KPb(2)Cl(2)). Cooling was observed when samples were pumped at wavelengths longer than 1557 nm, 17 nm longer than the mean fluorescence wavelength of 1540 nm, which implies a nonradiative heat load of 1.1% for the (4)I(13/2)-->(...
In this paper, dynamic transient method and conventional degree-hours method (static) have been compared to estimate heating and cooling loads of building’s wall. All main wall surfaces of various orientations, i.e.South, West, East, North, and horizontal are considered in the climate of Tehran, Iran. In this study, a conventional wall structure, which is comprisedconcrete as main wall material...
Past research in the field of shape memory polymers has led to significant advancements in the areas of so-called one-way and two-way (reversible) shape memory. While one-way shape memory polymers allow indefinite fixing of a temporary shape until triggered thermally to recover to an equilibrium shape, twoway shape memory polymers feature muscle-like contraction on heating and expansion on cool...
The semiconductor community is developing three-dimensional circuits that integrate logic, memory, optoelectronic and radio-frequency devices, and microelectromechanical systems. These three-dimensional (3D) circuits pose important challenges for thermal management due to the increasing heat load per unit surface area. This paper theoretically studies 3D circuit cooling by means of an integrate...
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