In this paper we will demonstrate how a thermodynamic-kinetic method can be utilized to rationalize a wide range of interfacial phenomena between Sn-based lead-free solders and Ni metallizations. First, the effect of P on the interfacial reactions, and thus on the reliability, between Sn-based solders and electroless Ni/immersion Au (ENIG) metallizations, will be discussed. Next, the effect of ...

The contents of seven major components (TiO2, Fe2O3, MgO, CaO, Na2O, K2O and P2O5) and 15 trace elements (Sc, V, Cr, Ni, Cu, Sr, Y, Zr, Ba, La, Ce, Nd, Eu, Yb and Th) were determined by ICP-AE spectrometry in 27 samples of manganese nodules, micronodules as well as abyssal clay collected by dredging from an area of nearly 1,9802 nautical miles in the central Clarion-Clipperton abyssal plain at ...

High quality graphene films can be fabricated by chemical vapor deposition (CVD) using Ni and Cu as catalytic substrates. Such a synthesis procedure always requires a subsequent transfer process to be performed in order to eliminate the metallic substrate and transfer the graphene onto the desired surface. We show here that such a transfer process causes significant contamination of the graphen...

Soybean oil was continuously hydrogenated in a slurry system to investigate the effects of linolenate content and additives on cooking oil performance. Room odor evaluations carried out on oils heated to 190 C after frying bread cubes showed that the oils hydrogenated with Cu catalyst to 2.4% linolenate (Cu-2.4) and with Ni catalyst to 4.6 linolenate (Ni-4.6) had a significantly lower odor inte...

Atomic motion and electronic structures of Pd–Ni–Cu–P bulk metallic glasses were investigated using P nuclear magnetic resonance. The hopping rate of P atoms was determined by the stimulated echo technique. Significant hopping was observed in all alloys well below the glass transition temperature. Increasing the Cu content to above 25 at. % increases P hopping significantly, consistent with the...

In this work we compared the effect of five heavy metals: Zn, Pb, Cd, Ni and Cu on phospholipid composition of the ubiquitous soil fungus Paecilomyces marquandii, originating from a strongly metal polluted area and characterized by high tolerance to these elements. Cd, Ni and Cu caused an increase in phosphatidylcholine (PC). Only Pb decreased PC content, which was accompanied by a significant ...

Agricultural soils contain both heavy metals and pesticides originating from various agricultural practices. It is quite important to study the relationships between these two classes of compounds. To accomplish this, 52 soil samples were collected from cotton fields and analyzed for their metal contents (Ni, Cu, Co, Pb, Cr, and Cd) and levels of most commonly used pesticides (imidacloprid, ace...

Chip Solder Joints Y. L. Lin, W. C. Luo, Y. H. Lin, C. E. Ho, and C. R. Kao Department of Chemical & Materials Engineering National Central University Jhongli City, Taiwan (*E-mail: [email protected] Phone/Fax: +886-3-4227382) Abstract The effects of Au thickness on the flip chip solder joints with the Cu/Ni/Al UBM on one end and the Au/Ni surface finish on another was studied. Two different th...