نتایج جستجو برای: degree of cure

تعداد نتایج: 21170638  

Journal: :Acta stomatologica Croatica 2016
Matej Par Matea Lapas-Barisic Ozren Gamulin Vlatko Panduric Nika Spanovic Zrinka Tarle

OBJECTIVES To investigate the long-term development of the post-cure degree of conversion (DC) for two flowable bulk-fill composites. MATERIALS AND METHODS Tetric EvoFlow Bulk Fill (TEFBF) and SDR were chosen due to their distinct compositional modifications that enable the decrease of translucency during polymerization and lower polymerization rate, respectively. DC was assessed using FT-Ram...

The first and second Zagreb indices of a graph are equal, respectively, to the sum of squares of the vertex degrees, and the sum of the products of the degrees of pairs of adjacent vertices. We now consider analogous graph invariants, based on the second degrees of vertices (number of their second neighbors), called leap Zagreb indices. A number of their basic properties is established.

Farideh Darabi, Hanieh Dadashi, Reza Tayefeh Davalloo, Seyedeh Maryam Tavangar, Yasaman Sadeghi, Zahra Atrkar Roushan,

Introduction: To evaluate and compare shear bond strength of self-cure and  light-cure composites using a universal bonding system. Materials and Methods: Superficial coronal dentin of 62 intact extracted  premolars was exposed and bonding agent (All-Bond Universal) was applied over the  dentin surface according to the manufacturer instruction (self-etch mode). Then  samples were distribut...

2016
Kent Miller

This paper examines the effects of some key operating parameters of UV sources on the curing of various UV inks, coatings and adhesives. The effects of peak UV wavelength and peak intensity are quantitatively evaluated using FT-IR. The data are helpful in guiding both formulators, raw material suppliers and end users to better understand the impact of the UV sources, especially UV LED sources, ...

Journal: :Microelectronics Reliability 2012
M. Sadeghinia Kaspar M. B. Jansen Leo J. Ernst

In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. During these processing steps residual stresses are built up resulting from both cure and thermal shrinkage. These residual stresses add up to the st...

Journal: :Polymer Testing 2021

During curing of thermosetting polymers, crosslinking results in hardening or stiffening the material. In electronics, for example encapsulating integrated circuits (die bonding), thermosets are fully cured a controlled environment (under UV-light within thermal oven) such that highest stiffness possible has been achieved. building materials, specifically used fastening systems (adhesive anchor...

2014
Yimei Li Daniel F Heitjan Daniel F. Heitjan

In smoking cessation clinical trials, subjects commonly experience a series of lapse and recovery episodes of varying lengths. Any quit episode may become permanent, in the sense that the subject stops smoking for good, and any lapse may also become permanent, in the sense that the subject abandons the quit attempt entirely. Individual quit patterns may reflect the effects of treatment and meas...

ژورنال: بیماری های پستان 2022
Fendereski, Afsaneh , Haghighat, Shahpar , Hajizadeh, Ebrahim , Rasekhi, Aliakbar ,

Introduction: Breast cancer is the most common cancer among women. Today, with advancements in medical sciences, increasing the cure probability of patients as well as increasing survival time is an important goal of cancer treatment. Therefore, in this study, in addition to examining patients’ survival, we investigated the cure probability of breast cancer patients and its prognostic factors u...

Journal: :Composites Part A-applied Science and Manufacturing 2021

The present paper addresses the simulation of a concept for manufacturing aerospace quality carbon/epoxy composite curved parts using pultrusion. In this approach, part is first partially cured in pre-former followed by final curing post-former. An epoxy resin system has been fully characterised and corresponding constitutive material models, incorporating dependence on both temperature degree ...

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