نتایج جستجو برای: electroless composite

تعداد نتایج: 123417  

2011
F. Münch U. Kunz C. Neetzel S. Lauterbach H.-J. Kleebe W. Ensinger M. A. Sanchez-Castillo C. Couto W. B. Kim L. Z. Hua A. Rydh W. K. Kwok

Electroless metal plating in combination with nanochannel-containing templates is a versatile method for the fabrication of metal nanotubes [1]. In contrast to the electrodeposition of metals, electroless plating relies on the surface-selective chemical reduction of a metal precursor [2]. The simultaneous coverage of the whole template surface with metal nanoparticles favors the formation of tu...

2016
D. Sameer Kumar K. N. S. Suman P. Rohini Kumar

This paper deals with the preparation and characterization of Nickel-coated Alumina ceramic particles by Electroless Plating Technique. Nanosized α-Al2O3 powders of about 50nm in diameter are used for plating. The bath for Electroless Nickel Plating is prepared with NiCl2.6H2O, C6H5NaO7.H2O, NH4Cl and NaH2PO2.H2O. A bath temperature of 85°C, pH value of 8 and stirring time of 20 min is consider...

Journal: :international journal of iron & steel society of iran 2004
n parvini-ahmadi m. a. khosravipour

in this research a layer of ni-cu-p was deposited on 304 stainless steels by using gelatin and thiourea asadditives in a sulfate solution. in order to determine the properties of deposited layers, a microhardness testerwas used for microhardness measurement, x.r.d. for microstructural analysis, and a scanning electronmicroscope equipped with e.d.x. for determining morphology and analyzing the d...

2001
Jae-Woong Nah Kyung-Wook Paik

In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn–36Pb–2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-lik...

Journal: :Composites Part A-applied Science and Manufacturing 2021

Lightning strike emulator was employed for evaluating the response of copper electroless coatings on epoxy-CFRP laminates under these high demanding electrical events. Samples were coated 15 and 30 min producing 0.6 1.2 µm thick layers, respectively, their performances compared with commercially protected naked laminates. Data show that a thin layer can improve performance CFRP 40 kA discharges...

Journal: :Europan journal of science and technology 2022

In this study, electroless Ni-B depositions were achieved on the St-37 steel substrates at different NaBH4 concentrations and 950 oC 1 hour. Electroless deposited samples had a cauliflower-like surface texture that makes lubricating naturally as concentration increased, grain size decreases in microstructure. XRD spectra of sample showed partial amorph region together with crystalline region. M...

Journal: :Journal of the Surface Finishing Society of Japan 1997

Journal: :ACS applied materials & interfaces 2010
Yu-Fen Tzeng Hung-Chi Wu Pei-Sun Sheng Nyan-Hwa Tai Hsin Tien Chiu Chi Young Lee I-Nan Lin

This work describes newly structured stacked silicon nanowires (s-SiNWs), consisting of nanosized silicon wires on top of silicon microrods (SiMRs) and exhibiting pronouncedly superior electron field emission (EFE) characteristics to the conventional SiNWs, by using a two-step electroless metal deposition process. Experimental results indicate that for these s-SiNWs, the electrostatic "screen e...

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