Among various lead-free alloys, Sn-Ag(-Cu) system solders are considered the most promising lead-free solders for both wave and reflow soldering technology. Moreover, to improve the characteristics of lead-free solders, the effect of the addition of minor elements to lead-free solders on the properties of solder and interfacial reactions have been studied. The purpose of this research was to in...

Magnesium-based bulk metallic glass matrix composites (BMGMCs) have better plasticity than the corresponding bulk metallic glasses (BMGs); however, their strength and density are often compromised due to the fact that the effective reinforcement phase is mostly plastic heavy metal. For lightweight SiC-particle reinforced BMGMCs, interface wettability and the sharpness of the particles often red...

Novel nickel-based microlattice materials with structural hierarchy spanning three different length scales (nm, lm, mm) are characterized microstructurally and mechanically. These materials are produced by plating a sacrificial template obtained by self-propagating photopolymer waveguide prototyping. Ni–P films with a thickness of 120 nm to 3 lm are deposited by electroless plating, whereas thi...

Hydrogen embrittlement of SK85 high-strength steel sheets was evaluated through a three-point bending test. The effects electroless Ni–P plating and Ni electroplating on hydrogen were examined with respect to the permeability plated films. On morrow plating, indicates high degree embrittlement, irrespective phosphorus content in film. However, is further suppressed than that which can be attrib...