نتایج جستجو برای: ni3al intermetallic

تعداد نتایج: 4021  

Journal: :international journal of advanced design and manufacturing technology 0
seyed khatiboleslam sadrnezhaad sharif university of technology shahin katiraei abbas ghasemi

intermetallic phase formation and oxidation reaction during combustion synthesis (cs) of ni-ti equiatomic mixture are affected by mechanical activation (ma) and pre-heating conditions. important parameters are ignition time, reaction duration, temperature rise, microstructural change, titanium oxidation and intermetallic phase formation. superelasticity and shape memory effects are influenced b...

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In this research, effect of time and temperature of TLP process on the microstructure, mechanical properties and corrosion resistance of CP-Ti to 316L stainless steel joint evaluated. For this purpose pure copper foil with 100 µm thickness was used as interlayer and joining process carried out at 950˚C, 1000˚C and 1050˚C and for 90, 120 and 150 minutes. After the joining process, shear and micr...

Journal: :Chemical communications 2008
Susanne Striegler Moses G Gichinga

The sugar recognition by binuclear copper(II) complexes in solution is strongly dependent on secondary interactions and cannot be predicted from the intermetallic Cu...Cu distance.

Journal: :Microelectronics Reliability 2006
Periannan Arulvanan Zhaowei Zhong Xunqing Shi

In this study, microstructure evolution at intermetallic interfaces in SnAgCu solder joints of an area array component was investigated at various stages of a thermal cycling test. Failure modes of solder joints were analyzed to determine the effects of process conditions on crack propagation. Lead-free printed-circuit-board (PCB) assemblies were carried out using different foot print designs o...

2005
Toni Mattila

The reliability of portable electronic devices was studied by applying standardized test procedures for test vehicles that represent the technologies and lead-free materials typically used in novel portable products. Thermal cycling and drop testing are commonly used because they reveal the failure modes and mechanisms that portable devices experience in operational environments. A large number...

Journal: :Bulletin of the Japan Institute of Metals 1987

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