For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the...

Copper and its alloys are extensively used in marine applications due to high corrosion resistant behavior. But the immunity of copper varies with environmental factors especially sea water ingredients. Many researchers investigated level materials different oceans/seas. Unfortunately, such study is missing Bay Bengal water. Moreover, inclusion alloying elements can have influence on behavior c...

Introduction Intermetallic compounds (IMCs) are generally considered a bad thing in solder joints, though this is not always the case. Excessive IMCs in solder joints are a bad thing since they significantly alter both the composition and the mechanical performance of the solder joint. Interfacial IMC layers can be an indication of the quality of the solder joint and the lack of them would indi...

There is an increasing demand for replacing tin-lead (Sn/Pb) solders with lead-free solders in the electronics industry due to health and environmental concerns. The European Union recently passed a law to ban the use of lead in electronic products. The ban will go into effect in July of 2006. The Japanese electronics industry has worked to eliminate lead from consumer electronic products for s...

A Dimitrescu, D. F. Niţoi, Z. Apostolescu, Engineering and Tehnological Systems Management Faculty, Polytehnic University of Bucharest, Romania, D. Dobrotă, Engineering Faculty, University “Constantin Brâncuşi” of Târgu-Jiu, Romania Brazing is applied to the merge of the pieces which are most required, tensile strength of the solder can reach high values. By brazing there can be assembled piece...