Sn-3.5Ag (1%Cu 1%Zn 5%Bi 5%In) Cu Au A new wettability evaluating system was developed by combining a contact angle measurement instrument, which optically and insitu measures the contact angle of molten solder, with a conventional wettability tester (meniscograph). Using this new evaluation system, a well-known experiential knowledge that the wettability for Sn-3.5Ag, a typical Pbfree solder, ...

Sutureless end to end ureteral anastomoses was successfully constructed in acute and chronic experiments. A photothermal sensitive hydrolyzable (PSH) albumin stent played roles as solder and intraluminal supporter to adhesion and position the anastomosed ureter by end to end fashion. The anastomosis seam was lased with 810 nm diode laser energy supplied through hand-held 600 mm noncontact optic...

Large open surgical approaches are being extensively replaced by endoscopic and robotic techniques. Yet, these developments have not been paralleled by the necessary improvements in tissue adaptation, fusion or fixation. In order to advance the surgical area to a higher and improved level, adequate tissue fusion methods need to be designed. We therefore developed a sutureless electromagnetic ti...

The following application note represents a general guideline for mounting LEDs of the Golden DRAGON with Lens product family. A basic overview of the construction of LEDs and important design rules for the development of LED systems are provided. In addition, the principal processing steps are illustrated for the Golden DRAGON ARGUS LED, and general information about mounting is summarized. In...

Silver sintering joints and AuGe soldering are promising technologies for high temperature (>200 C ambient) power electronics packaging. This paper presents the implementation of two silver-sintering processes with the one hand micrometer-scale silver particles, and on the other hand nano-meter-scale particles. Two substrates technologies have been investigated: A12O3 DBC and Si3N4 AMB. After t...

Just like soldering, wire bonding appears to be a simple process and is frequently taken for granted. People tend to think all that is required to have a high quality bonding process is a simple wire pull test to monitor and control the process. But like soldering, this process is complex and requires a thorough understanding of the metallurgy, thermodynamics, and surface chemistry involved. Th...

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during ...

We report a simple lithography-free, solution-based method of soldering of carbon nanotubes with Ohmic contacts, by taking specific examples of multi-walled carbon nanotubes (MWNTs). This is achieved by self-assembling a monolayer of soldering precursor, Pd(2+) anchored to 1,10 decanedithiol, onto which MWNTs could be aligned across the gap electrodes via solvent evaporation. The nanosoldering ...