ABSTRACT A novel hydrogen activation technology based on activated or electron attachment (EA) has been developed for fluxless soldering at ambient pressure and normal temperature. The the potential to be used several applications in electronics packaging industry. Recent work from a joint effort between Air Products Sikama International alpha trials of production-scale furnace flux-free wafer ...

LEGO-style cut-and-choose is known for its asymptotic efficiency in realizing actively-secure computations. The dominant cost of LEGO protocols is due to wire-soldering — the key technique enabling to put independently generated garbled gates together in a bucket to realize a logical gate. Existing wire-soldering constructions rely on homomorphic commitments and their security requires the majo...

LEGO-style cut-and-choose is known for its asymptotic efficiency in realizing actively-secure computations. The dominant cost of LEGO protocols is due to wire-soldering — the key technique enabling to put independently generated garbled gates together in a bucket to realize a logical gate. Existing wire-soldering constructions rely on homomorphic commitments and their security requires the majo...

Examination of the records of employees leaving an electronics factory over three-and-a-half years showed that a significantly greater proportion left the shop floor (where soldering took place) because of ill health than left the stores and office areas. This difference was largely due to work-related respiratory disease in those whose job was soldering. Shop floor workers leaving for health r...

The Pads have unique values of thermophysical properties (THP) having important contribution over heat transfer into the PCB structure. Materials with high thermal diffusivity (TD) rapidly adjust their temperature to that of their surroundings, because the HT is quick in compare to their volumetric heat capacity (VHC). In the paper is presenting the diffusivity tests (ASTM E1461 flash method) f...

The soldering of small, delicate electronic devices by means of a blade thermode (a small, thin, rectangular or -shaped soldering iron) requires the lower side of the thermode to have a uniform temperature distribution. This is not easily obtained: during start-up the corners tend to be too hot, and too cold in the stationary phase. In the present study the various aspects that determine the he...

We have devoted an effort to study some nonlinear actions, characteristics of the W-theories, in the framework of the soldering formalism. We have disclosed interesting new results concerning the embedding of the original chiral W-particles in different metrical spaces in the final soldered action, i.e., the metric gets modified by the soldering interference process. The results are presented i...