Gold-coated silver wire was developed to alleviate the high cost of Au used in semiconductor packaging. Ball-bonding and stitch-bonding techniques were fabricate dummy packaging material, comprising 97.3 % Ag, 97.3% Au-Coated 99.99 %Au wires. The ball shear test (BST), pull (BPT), microstructural attributes ultrasonic bonding interfaces compared with initial properties, both before after highly...