The poly(ethyleneimine)-functionalized silica has been developed successfully as an effective adsorbent for the adsorption removal of Cu(II) ions from electroplating wastewater. The influences of pH, contact time and initial concentration of Cu(II) ions on the adsorption capacity and the effect of adsorbent dosage on the removal efficiency of Cu(II) ions from electroplatin...

We demonstrated a practical process of fabricating nickel molds for nanoimprinting. Dual-side polished glass is chosen as the substrate on which nickel nanostructures are successfully electroplated. Photonic crystal structures with 242 nm diameters and other nanoscale pillars down to 9 nm diameters are achieved over a large area. The electroplating parameters are investigated and optimized. Thi...

Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-sha...

Electroplating uses aluminum material, where it’s easy to obtain, lighter, and cheaper than other metals. The research goal was determine the ability of electric current power (Al) coated with silver (Ag) by electroplating method, effect magnitude length time coating process took on weight Al Ag strength metal after tested using Brinnell test. method used is compare pure at different currents p...