A primary cause of failure in microelectronic devices is void growth and movement in aluminum wire interconnects. In addition to thermal and mechanical stress, void evolution is driven by the electric field in the wire. Two new boundary element techniques, approximate Green's functions and Galerkin surface derivative evaluation, have been developed to assist in modeling the electromigration pro...

Boundary integral equations are a classical tool for the analysis of boundary value problems for partial differential equations. The term “ boundary element method” (BEM) denotes any method for the approximate numerical solution of these boundary integral equations. The approximate solution of the boundary value problem obtained by BEM has the distinguishing feature that it is an exact solution...

In order to overcome the difficulties of low computational efficiency and high memory requirement in the conventional boundary element method for solving large-scale potential problems, a fast multipole boundary element method for the problems of Poisson equation is presented. First of all, through the multipole expansion and local expansion for the basic solution of the kernel function of the ...

In this paper, the boundary-based estimation of pressure distribution in the cardiovascular system is investigated using two dimensional flow images. The conventional methods of non-invasive estimation of pressure distribution in the cardiovascular flow domain use the differential form of governing equations. This study evaluates the advantages of using the integral form of the equations in the...

A boundary element formulation for the solution of multiple moving boundary problems is presented and tested herein. A heat transfer problem involving heating of solid, melting of solid and vaporisation of liquid is considered. Numerical results show that the boundary element method is more suitable and more accurate than both finite difference and finite element methods for this kind of problems