Optical interconnects to couple light from single mode fiber to waveguides and photonic elements have remained expensive due to tight alignment tolerances, materials choices, fabrication methods and assembly processing techniques. Methods that have been used to lower the cost of optical interconnects will be reviewed and compared to current and future market application demands. Design approach...

In the multi and many core era, communication is crucial to the system performance. Therefore, network-on-chip (NoC) approaches were proposed to regularize the design of on-chip communication. Nanophotonic interconnects have been proposed in the recent few years as a replacement of global metal interconnect because of their almost distance-independent power consumption and low-latency and high ...

As technology scales, increasing clock rates, decreasing interconnect pitch and the introduction of low-k dielectrics have made self-heating of the global interconnects an important issue in VLSI design. Further, high bus temperatures have had a negative impact on the delay and reliability of on-chip interconnects. Energy and thermal models are used to characterise the effects of self-heating o...

Abstract The growth of computing needs for artificial intelligence and machine learning is critically challenging data communications in today’s data-centre systems. Data movement, dominated by energy costs limited ‘chip-escape’ bandwidth densities, perhaps the singular factor determining scalability future Using light to send information between compute nodes such systems can dramatically incr...

SiP interconnects are envisioned for large scale distributed computing platforms. In such applications, optical systems involving millions of devices have to be modeled. We review key model transformation methods that allow scalable modeling. OCIS codes: (200.4650) Optical interconnects; (130.6750) Systems

This article reviews the current state-of-the-art of millimeter-wave (mm-wave) antennas for communication and sensing applications in D-band between 110 170 GHz. The most popular design techniques, including Antenna-on-Board (AoB), slotted waveguides, Antenna-in-Package (AiP) Antenna-on-Chip (AoC), are described using relevant examples from scientific literature. Potential benefits limitations ...

Introduction: Optics is a viable solution to address the limitations of copper-based electronics in short-distance interconnects [1]. In these compact systems, devices must meet the stringent requirements imposed by the power budget and the thermal restriction. Recently, VCSELs have received considerable interest for board and chip level interconnects owing to their small footprints, ease of fa...

ELECTRONIC AND OPTICAL MATERIALS A: Amorphous and Polycrystalline Thin-Film Silicon Science and Technology B: Concepts in Molecular and Organic Electronics C: CMOS Gate-Stack Scaling—Materials, Interfaces, and Reliability Implications D: Materials, Processes, and Reliability for Advanced Interconnects for Microand Nano-Electronics E: Science and Technology of Chemical Mechanical Planarization F...

3.4.5. Example 5: Volcanic Activity 658 3.4.6. Example 6: Soil Moisture 659 3.5. Discussion and Conclusions 659 4. Body Sensor Networks 661 4.1. Wearable Sensors 661 4.2. Functionalized Fabrics 662 4.2.1. Metal Fibers 662 4.2.2. Conductive Inks 662 4.2.3. Inherently Conducting Polymers 662 4.2.4. Optical Fibers 662 4.2.5. Coating with Nanoparticles 662 4.2.6. Integrated Components 663 4.2.7. We...