نتایج جستجو برای: delamination damage
تعداد نتایج: 228976 فیلتر نتایج به سال:
This paper presents the development of a new 3D finite element model for simulation UD composites materials under crushing, at mesoscale. It is based on Discrete Ply Model (DPM), enhanced with damage law to represent compression constant stress due localised crushing and its propagation from one another. The aims take into account various types involved in laminates during associated absorbed e...
Delamination is one of the most concern defects in drilling of composite material. Delamination depends on the factors such as feed rate, tool geometry and wear. The mechanics of drilling composite materials has been examined along with the quality of the hole and the effect of tool design parameters. The capacity of computerized tomography (CT) showing sample cross-section in a nondestructive ...
Interface delamination is the major weakness limiting diamond coating tool performance in machining. Thus, quantitative characterizations of the interface behavior are important to better understand and design diamond coating tools. In this study, we attempt to apply a cohesive zone model to investigate the coating-substrate interface behavior. The cohesive zone model is based on the traction-s...
Films formed through the drying of nanoparticle suspensions release the build-up of strain through a variety of different mechanisms including shear banding, crack formation and delamination. Here we show that important connections exist between these different phenomena: delamination depends on the dynamics of crack hopping, which in turn is influenced by the presence of shear bands. We also s...
To detect delamination in integrated circuit (IC) packages, a millimeter-wave inspection system was developed. An open-ended coaxial line sensor was used as a source and also a receiver of the millimeter-wave signal that was transmitted into and reflected from the packages. The phase of the reflection coefficient was measured for inspection of the delamination. The package was scanned in two pe...
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