Among various lead-free alloys, Sn-Ag(-Cu) system solders are considered the most promising lead-free solders for both wave and reflow soldering technology. Moreover, to improve the characteristics of lead-free solders, the effect of the addition of minor elements to lead-free solders on the properties of solder and interfacial reactions have been studied. The purpose of this research was to in...

Microwave (MW) plasma was applied to the surface of polyimide (PI) films as a treatment to enhance the adhesion between copper deposition layer and PI surface for electroless plating. The influences of nitrogen MW plasma treatment on chemical composition of the PI surface were investigated by using X-Ray photoelectron spectroscopy (XPS). The wettability was also investigated by water contact an...