High temperatures caused by partial discharge results in the decomposition of insulating epoxy resins in electrical equipment. In this paper, the ReaxFF force field is used to investigate the decomposition process of epoxy resins cured by anhydride and the formation mechanisms of small-molecule gases. Results show that the initiation reaction is the cleavage of an ester bond linked with an epox...

-In the present work an attempt is made to evaluate the suitability of composite material such as E-Glass/Epoxy and HMCarbon/Epoxy for the purpose of automotive transmission applications. A one-piece composite drive shaft for automobile is designed and analyzed using ANSYS software respectively for E-Glass/ Epoxy and HM-Carbon/Epoxy composites with the objective of minimization of weight of the...

A fiber optic ultrasonic system is described which monitors the cure of an epoxy resin. Ultrasound is generated using a high-power optical fiber to deliver high-energy pulses of light to the prepared surface of an aluminum mold that contains the curing epoxy resin. The generated ultrasound is detected using a local fiber optic ultrasound sensor embedded in the curing epoxy resin. The system was...

Epoxy resins are often exposed to prolonged periods of sub-Tg temperatures which cause physical aging to occur. Because physical aging can compromise the performance of epoxies and their composites and because experimental techniques cannot provide all of the necessary physical insight that is needed to fully understand physical aging, efficient computational approaches to predict the effects o...

Organic–inorganic interfaces exist in many natural or synthetic materials, such as mineral–protein interfaces found in bone and epoxy–silica interfaces found in concrete construction. Here, we report a model to predict the intrinsic strength between organic and inorganic materials, based on a molecular dynamics simulation approach combined with the metadynamics method, used to reconstruct the f...

Research in the field of shape memory polymers has recently witnessed the introduction of increasing complexity of material response, including such phenomena as triple/multishape behavior, temperature memory, and reversible actuation. Ordinarily, such complexity in physical behaviour is achieved through comparable complexity in material composition and synthesis. Seeking to achieve a triple sh...

Liquid epoxy resins have received much attention from both academia and the chemical industry as eco-friendly volatile organic compound (VOC)-free alternatives for applications in coatings and adhesives, especially in those used in households. Epoxy resins show high chemical resistance and high creep resistance. However, due to their brittleness and lack of thermal stability, additional fillers...

Adhesion is important in many industrial applications including those in the microelectronics industry. Flip-chip assemblies commonly utilize epoxy underfills to promote reliability and the buried interfacial structure of underfills is crucial to device lifetime. Poor adhesion at this interface can cause premature device failure. One method to increase adhesion strength is to plasma treat the s...

The correlation between the mechanical properties of Fillers/Epoxy composites and their tribological behavior was investigated. Tensile, hardness, wear, and friction tests were conducted for Neat Epoxy (NE), Graphite/Epoxy composites (GE), and Data Palm Fiber/Epoxy with or without Graphite composites (GFE and FE). The correlation was made between the tensile strength, the modulus of elasticity,...

The synthesis of polymers from renewable resources is a burning issue that is actively investigated. Polyepoxide networks constitute a major class of thermosetting polymers and are extensively used as coatings, electronic materials, adhesives. Owing to their outstanding mechanical and electrical properties, chemical resistance, adhesion, and minimal shrinkage after curing, they are used in stru...