نتایج جستجو برای: functionally graded nano composite
تعداد نتایج: 243655 فیلتر نتایج به سال:
in this study, aluminum (al) matrix reinforced with micro-particles (30 µm) and nano-particles (50 nm) boron carbide (b4c) were used to prepare al-2.5%wt., b4c nano-composite and micro-composite, respectively, using mechanical alloying method. the mixed powders were mechanically milled at 5, 10, 15 and 20 hrs. the xrd results indicated that the crystallite sizes of both the micro-composite and ...
Functionally graded materials are important in laboratory and industry. These have opened a new area of research. functionally can be produced as result composite material by the adding more to get desired properties make it perfect for suitable applications. In this paper, focus is on modelling that developed resist wear any friction or erosion liquid. Cemented Carbide (WC) was selected common...
The aluminum metal matrix composites were broadly exploited in the applications of automotive, aerospace, and other defense with functionally graded materials-related application. Above definitely required excellent mechanical characteristics. Therefore, this way, major attempt was made on nano-based alloy utilization. In research, AA8011 ceramic-based reinforcement particles nano boron carbide...
statement of the problem addition of metallic nano-particles to composite resins can change their water contact angle purpose the aim of this study was to evaluate the effect of addition of nano-particles of silver and zinc oxide to composite resins on their water contact angle materials and methods this in vitro study was performed on 60 composite resin samples. nano-silver and nano-zinc oxide...
Recently, nano-composite solders have been developed in the electronic packaging materials industry to improve the creep and thermo-mechanical fatigue resistance of solder joints to be used in service at high temperatures and under thermo-mechanical fatigue conditions. This paper reviews the driving force for the development of nano-composite solders in the electronic packaging industry and the...
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