Present-day photonic terahertz (100 GHz–10 THz) systems offer dynamic ranges beyond 100 dB and frequency coverage 4 THz. They yet predominantly employ free-space Terahertz propagation, lacking integration depth miniaturisation capabilities without sacrificing their extreme coverage. In this work, we present a high resistivity silicon-on-insulator-based multimodal waveguide topology including ac...

Until now only cursory descriptions of mathematical models for defect sensitivities of integrated circuit chips have been given in the yield literature. This paper treats the fundamentals of the defect models that have been used successfully at IBM for a period of more thanjifteen years. The effects of very small defects are discussedjirst. The case of photolithographic defects, which are of th...

The history of micro system electronics is briefly traced through the successive stages of: miniaturization; subminiaturization; microminiaturization; thin-film integrated circuits; semiconductor integrated circuits; and finally morphological integrated circuits or functional blocks. The term integrated circuit is defined as the combination, on or within a single chunk of material, of multiple ...

The demand for increasing speed and low power dissipation triggers numerous research efforts with the increasing demand of wireless portable communication systems in underground mines driven by batteries. Presence of highly flammable gases in underground mines prohibits the use of higher power dissipating electronic systems. Low power wireless portable communication devices can safeguard the li...

Trustworthy system development entails a high nonrecurring engineering (NRE) cost together with a low volume of units over which to amortize that cost. For example, the potential for developmental and operational attacks against hardware requires countermeasures that make it very expensive to design and manufacture custom hardware used to build high assurance systems. To address these problems,...

Our analog and mixed-signal VLSI course uses two hardware labs. The mirrors lab demonstrates the effects of mismatch and oxide encroachment on transistors and current mirrors. The students experiment with individual transistors and three different sets of mirror circuits to obtain a handson experience with some of the limitations of integrated circuit processing. The chip has been fabricated us...

The purpose of this paper is to evaluate the weight values of key factors in a manager’s leadership skills that affect job performance in the listed IC Design Houses in Taiwan. The research subjects are three of the typically listed IC design houses in Taiwan. This paper adopts Analytic Network Process (ANP) to analyze the relevance of each criterion, and to identify the important factors of ea...

Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to ...

In the past few years, several tools for the automation of the analog integrated circuit (IC) cell and system layout design, with application on both new and reused designs have emerged. Yet, most of the layout design is still handmade, essentially because analog designers want to have total control over the different design options, and also, due to the fact that current fully automated genera...