نتایج جستجو برای: ni3al intermetallic

تعداد نتایج: 4021  

2012
Christoph Rameshan Harald Lorenz Lukas Mayr Simon Penner Dmitry Zemlyanov Rosa Arrigo Michael Haevecker Raoul Blume Axel Knop-Gericke Robert Schlögl Bernhard Klötzer

In situ X-ray photoelectron spectroscopy (in situ XPS) was used to study the structural and catalytic properties of Pd-In near-surface intermetallic phases in correlation with previously studied PdZn and PdGa.Room temperature deposition of ∼4 monolayer equivalents (MLEs) of In metal on Pd foil and subsequent annealing to 453 K in vacuum yields a ∼1:1 Pd/In near-surface multilayer intermetallic ...

F Foadian, M Adeli, M Etminanbakhsh, M Soltanieh,

Metallic-intermetallic laminate (MIL) composites are promising materials for structural applications especially in the aerospace industry. One of the interesting laminate composites is the Ti-TiAl 3 multilayer. In this work, commercially pure sheets of aluminum and titanium with almost equal thickness of around 0.5 mm were explosively joined. The achieved multilayers were annealed at 630 ℃in di...

2016
Yongsoo Park Michael J. Driscoll Thomas J. McKrell

Disposal packages containing high heat generating spent nuclear fuels (SNF) require improved heat transfer to keep the peak cladding temperature from going above the tolerance limit. Filling the accessible void spaces between the container and the SNF with a high heat conducting metal is a potential solution. In metal casting, it is well known that a gap forms at the metal-mold interface due to...

Journal: :Journal of the Japan Society of Powder and Powder Metallurgy 1998

Journal: :Acta Crystallographica Section A Foundations and Advances 2014

Journal: :international journal of iron & steel society of iran 2015
h. sharifi

zinc coating is formed by the heterogeneous assembly of the γ, γ1, δ, ζ and η phases whose mechanicalproperties greatly differ from each other. thermal strains resulting from large differences betweenthermal expansion coefficients are partially relaxed by the formation of a crack network. in order tomodel this phenomenon, initial hardness, thermal expansion coefficient αi and toughness (kic) of...

Journal: :Microscopy research and technique 1993
K W Kirchner G K Lucey J Geis

Copper samples, hot solder (eutectic) dipped and thermally aged, were cross-sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for approximately 2.5 h at 170 degrees C to stimulate the growth of additional Cu/Sn intermetallic compound. The intent of the study was to obtain a continuous real-time videotape record of the diffu...

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