نتایج جستجو برای: packaging film

تعداد نتایج: 109846  

Journal: :IEEE Trans. Instrumentation and Measurement 2000
Paul C. de Jong Gerard C. M. Meijer

This paper describes a high-temperature pressure-transducer interface for resistive Wheatstone bridges. The long-term drift of the smart sensor, i.e., the (pressure) sensor plus its interface electronics, will be determined by the drift of the sensor element only. A three-signal auto-calibration sequence of the interface electronics keeps the transducer interface virtually free of long-term dri...

2012

Traditional and modern supply chains for tomato in Cambodia were assessed and possible handling improvements were introduced. Traditional chain involved farmers and collectors in Kandal Province, and wholesalers and retailers in wet markets in the capital of Phnom Penh, about 35 km apart. In the modern chain, only one intermediary between farmers and supermarkets in Phnom Penh was involved; col...

Journal: :IBM Journal of Research and Development 1999
George A. Katopis Wiren D. Becker Toufie R. Mazzawy Howard H. Smith Charles K. Vakirtzis Scott A. Kuppinger Bhupindra Singh Phillip C. Lin John Bartells Gregory V. Kihlmire Panangattur N. Venkatachalam Herb I. Stoller Jason L. Frankel

The multichip module (MCM) that contains the central electronic complex (CEC) of the S/390 G5 system is described in this paper. The glass-ceramic module, topped with six layers of polyimide full-field thin-film wiring for chipto-chip interconnection, represents IBM’s most advanced packaging technology. This MCM provides a large wiring capacity, with 595 meters of routed interconnection; it sup...

2014
Samantha Serra Costa Janice Izabel Druzian Bruna Aparecida Souza Machado Carolina Oliveira de Souza Alaíse Gil Guimarães

The aim of this study was to characterize and determine the bi-functional efficacy of active packaging films produced with starch (4%) and glycerol (1.0%), reinforced with cellulose nanocrystals (0-1%) and activated with alcoholic extracts of red propolis (0.4 to 1.0%). The cellulose nanocrystals used in this study were extracted from licuri leaves. The films were characterized using moisture, ...

2017
Mahsa Tabari

Using biodegradable films is increasingly growing since they contain natural materials. In this study, sago starch and carboxymethyl Cellulose (CMC) were used in film preparation. Sago starch films with 0, 5, 10, 15 and 20% CMC concentrations were prepared using solvent casting method. The mechanical properties were determined according to standards of American Society for Testing and Materials...

2007
W. Li D. C. Rodger P. R. Menon Y. C. Tai

In this paper, we study the corrosion behavior of parylene-metalparylene thin films using accelerated-lifetime soak tests. The samples under test are thin film resistors with a 200 nm layer of Au sandwiched by parylene-C on both sides, fabricated with parylenemetal skin technology. The samples are tested in hot saline both passively and actively, and different failure modes are observed using o...

Journal: :Optics express 2009
Jim-Yong Chi Ji-Siao Chen Chuan-Yu Liu Cheng-wen Chu Kuo-Hsien Chiang

A packaging scheme utilizing omni-directional reflective (ODR) optical coating is described to enhance the light extraction of near UV excited, phosphor-converted LEDs. A simple 1D model was developed to analyze the spectra of the extracted light measured with an integration-sphere as a function of phosphor layer concentration and thickness. Quantitative determination of the absorption coeffici...

Journal: :IBM Journal of Research and Development 2005
Edmund D. Blackshear Moises Cases Erich Klink Stephen R. Engle Ronald S. Malfatt Daniel N. deAraujo Stefano Oggioni Luke D. Lacroix Jamil A. Wakil Nam H. Pham Gareth G. Hougham David J. Russell

package technology and its design challenges E. D. Blackshear M. Cases E. Klink S. R. Engle R. S. Malfatt D. N. de Araujo S. Oggioni L. D. LaCroix J. A. Wakil G. G. Hougham N. H. Pham D. J. Russell This paper reviews sequential build-up (SBU) laminate substrate development from its beginning in 1988. It reports on developments in this technology for IBM applications since its adoption in 2000. ...

2004
C T Pan

In this study, a new technique of selective microcap bonding for packaging 3-D MEMS (Micro Electro Mechanical Systems) devices is presented. Microcap bonding on a selected area of the host wafer was successfully demonstrated through flip chip and wafer level alignment. A passivation treatment was developed to separate the microcap from the carrier wafer. A thick metal nickel (Ni) microcap was f...

Journal: :ACS nano 2010
Liangbing Hu Hui Wu Fabio La Mantia Yuan Yang Yi Cui

There is a strong interest in thin, flexible energy storage devices to meet modern society needs for applications such as interactive packaging, radio frequency sensing, and consumer products. In this article, we report a new structure of thin, flexible Li-ion batteries using paper as separators and free-standing carbon nanotube thin films as both current collectors. The current collectors and ...

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