In this paper, we address the optimization of electrical and thermoelectrical properties nanostructured polysilicon material for integration in thermoelectric (TE) devices. particular, describe an original method to build a superficial porous (POpSi) thin film on Silicon substrate. This latter is electrically isolated from conductive substrate by SiO2 interlayer Van der Pauw electric home-made ...

A large-scale, high speed, high resolution, phase-only microelectromechanical system (MEMS) spatial light modulator (SLM) has been fabricated. Using polysilicon thin film technology, the micro mirror array offers significant improvement in SLM speed in comparison to alternative modulator technologies. Pixel opto-electromechanical characterization has been quantified experimentally on large scal...

A new two-dimensional multilayer process simulator based on finite element method has been developed to accuratly study advanced silicon technologies. The basic processing steps simulation are presented and numerical problems arising from the multilayer structures are outlined. Finally, the capabilities of the program are demonstrated with the simulation of a self-aligned polysilicon bipolar tr...

We present an approach for extracting thermal coefficients of higher order for different materials. Based on inverse modeling and using transient electrothermal simulations thermal investigations of complex layered polycrystalline silicon (Polysilicon) fuses are performed by a three dimensional interconnect simulator. This method is well suited to optimize different material compositions and ge...

Motivated by improvements in low-temperature polysilicon thin-film transistor (LTPS-TFT) processes, we designed a TFT-based dynamic-logic programmable logic array (PLA). We report the successful operation of the circuit with high repeatability. We thus demonstrate that the LTPS-TFT technology is mature enough to support aggressive circuit techniques such as dynamic logic.

This paper presents the progress in the development of a 4096 element MEMS deformable mirror, fabricated using polysilicon surface micromachining manufacturing processes, with 4μm of stroke, a surface finish of less than 10nm RMS, a fill factor of 99.5%, and bandwidth greater than 5kHz. The packaging and high speed drive electronics for this device, capable of frame rates of 22 kHz, are also pr...

An array of micromirrors for beam steering optical switching has been designed in a thick polysilicon technology. A novel semi-analytical method to calculate the static characteristics of the micromirrors by taking into account the flexural deformation of the structure is presented. The results are compared with 3D coupledfield FEM simulation.

Introduction: Charge-coupled devices (CCDs) have conventionally used overlapping (0.5–2.5 mm) polysilicon gates to achieve charge transfer between gates with a very high charge transfer efficiency (CTE) [1]. Since conventional CMOS processes do not allow poly-overlaps, it was not possible to achieve a ‘true’ CCD structure in this process until now, though efforts were made in this direction [2]...