Low power has emerged as a principal theme in today’s world of electronics industries. Power dissipation has become an important consideration as performance and area for VLSI Chip design. With shrinking technology reducing power consumption and over all power management on chip are the key challenges below 100nm due to increased complexity. For many designs, optimization of power is important ...

Recent technological advances in sensors, low-power integrated circuits, and wireless communications have enabled the design of low-cost, miniature, lightweight, and intelligent physiological sensor nodes. These nodes, capable of sensing, processing, and communicating one or more vital signs, can be seamlessly integrated into wireless personal or body networks (WPANs or WBANs) for health monito...

The complexity of huge-scale integrated circuits allowed by technology scaling down breeds design problems for the diÆculty in managing deep-submicron drawbacks. Thermal e ects have increasing impact on power supply bus reliability, and e ective line sizing based on trustable lifetime evaluation is of basic importance. This work presents an analysis of the impact on electromigration of technolo...

Better prediction of electromagnetic compatibility (EMC) for components is becoming a topical demand, due to technology improvements. It is requested by integrated circuit (IC) manufacturers as well as by equipment integrators. The French UTE standardisation group has proposed an EMC modelling methodology for ICs, called ICEM (Integrated Circuit Electromagnetic Model). This proposal improves an...

Decreased power supply levels have reduced the tolerance to voltage changes within power distribution networks in CMOS integrated circuits. High on-chip currents, required to charge and discharge large on-chip loads while operating at high frequencies, produce significant transient IR voltage drops within a power distribution network. Analytical expressions characterizing these transient IR vol...

For next generation planar lightwave circuit (PLC) devices, high function and high-density integration are required as well as downsizing and cost reduction. To realize these needs, high refractive index difference between a core and a clad (∆) is required. To use PLC for practical applications, silica-based PLC is one of the most attractive candidate. However, degradation of the optical proper...

We present an optoelectronic module called the equivalency-processing parallel photonic integrated circuit (EP(3)IC) that is created specifically to implement high-speed parallel equivalence searches (i.e., database word searches). The module combines a parallel-computation model with multiwavelength photonic integrated-circuit technology to achieve high-speed data processing. On the basis of s...

This paper presents a fixed gain high output power amplifier with performance determined by using on-wafer measurement. The amplifier is fully differential based on inductive load and resistive degeneration which is designed using a 0.18 μm SiGe BiCMOS process. The amplifier achieves power gain of 7.2 dB, 3-dB bandwidth of 2.06 GHz, operating frequency of 12 GHz, power consumption of 12 mW usin...

nsight is given into the APL Space Department’s Advanced Technology Development Program for spacecraft. After 40 years in the business of developing spacecraft, new technology and new methods entailing risk are still the lifeblood of the Laboratory’s contributions to the national space program. Today’s political environment concerning the use of new techniques in spacecraft and how we have come...