This paper presents a fast printed circuit board (PCB) inspection methodology based on the segmentation of the PCB image into basic patterns and context sensitive filtering of the difference image for functional defect detection. The system consists of three parts: (i) segmentation of the artwork and test board images into basic patterns using the CAD data for the artwork, (ii) comparison of th...

The common deterioration of civil infrastructure systems and the threat of extreme loadings require facility managers to improve their knowledge regarding the health of the structures that they manage. A dense array of wireless sensors installed in a structure could provide ample amounts of empirical data for monitoring structural health. In addition to being a low cost alternative to tradition...

A novel energy-saving hydrometallurgical recovery process for copper from electronic scrap employing the Cu(I)-ammine complex has been presented on the basis of a thermodynamic consideration. In order to experimentally explore the feasibility of the leaching stage in this process, the copper leaching behavior from a printed circuit board (PCB) in ammoniacal alkaline solutions has been investiga...

Crosstalk is an important problem in high-speed printed circuit board design which is one of the signal integrity issues. A wildly used theoretical model based on microstrip theory is presented in this paper. On this basis, the origin and the factors affecting crosstalk are introduced. Cadence Allegro is used to analyze these factors. Key-words: Signal integrity, crosstalk, aggressor line, vict...

Low cost millimetre wave modules are needed for emerging 60 GHz applications such as high speed wireless communications and millimetre wave identification (MMID). All applications require high performance antenna arrays to overcome the high propagation losses. Two alternative antenna array designs on a low cost substrate (Taconic Taclamplus) are presented and analysed in this paper. The arrays ...

In this work, we developed a new ion exchange plating (IEP) method that is different to traditional electrochemical plating or electroless plating techniques. A variety of silver patterns were prepared by using the IEP technique as demonstrated in this work. The key factors to the definition and the conductive performance of silver patterns were systematically studied. Mechanisms of the formati...

This paper presents a new design and fabrication process of a multiple-thickness electrochemical cantilever sensor, in order to assess the role of the cantilever’s thickness on the chemically-induced mechanical effects. Each cantilever can act not only as a functionalized cantilever, but also as an independent working electrode (WE) for electrochemical measurement. The different thicknesses of ...

Available microwave notch-type damage detection sensors are typically based on monitoring frequency shift or magnitude changes. However, frequency shift testing needs sweep-frequency data that make scanning detection becomes difficult and time-consuming. This work presents a microwave near-field nondestructive testing sensor for detecting sub-millimeter notch-type damage detection in metallic s...

As FPGA devices are used in high-speed applications, signal integrity and timingmargin between the FPGA and other devices on the printed circuit board (PCB) are important aspects to consider to ensure proper systemoperation. To avoid time-consuming redesigns and expensive board respins, the topology and routing of critical signals must be simulated. The high-speed interfaces available on curren...

Effective heat removal from the IC chip, through the package, to the adjacent environment is crucial to maintain an allowable device junction temperature. The latter directly affects the electrical circuit performance both at the component and system levels. Aside from thermal enhancement of individual packages by the IC manufacturers, proper printed circuit board (PCB) layout and cabinet desig...