The thermal cycling reliability of candidate copper and aluminium power substrates has been assessed for use at temperatures exceeding 300°C peak using a combination of thermal cycling, nanoindentation and finite element modelling to understand the relative stresses and evolution of the mechanical properties. The results include the relative cycling lifetimes up to 350°C, demonstrating almost a...

This paper compares the effective thermal resistance of 5 wall assemblies incorporating vacuum insulation panels (VIP) encased in extruded polystyrene (XPS), known as composite panels, through three different evaluation methods. The methods consisted of using steady-state and in-situ experimental testing as well as computer simulation. The computer modelling of the wall assemblies used simplifi...