Thermal management of integrated circuit (IC) and system-in-package (SIP) has gained importance as the power density and requirement for IC design have increased and need exists to analyse the heat dissipation performance characteristics of IC under use. In this paper, the authors examine the thermal characteristics of materials of IC. The authors leverage Cloud Computing architecture to remote...

Five novel ideas are proposed in this paper to integrate an active RFID tag with thermal convection angular accelerometer on a flexible substrate, thus the device is a wireless sensor. The first idea is that this device is without any movable parts, so it is very reliable. The second one is that it is made on a flexible substrate, such as plastic or polyimide, the thermal conductivity of the fl...

this study was undertaken to identify morphological changes in young seedlings of 5 iranian almond species (prunus dulcis, p. eburnea, p. eleagnifolia, p. haussknechti, and p. scoparia) under polyethylene glycol-induced drought stress. drought stress caused a significant reduction in plant growth parameters such as fresh and dry weights of plant organs, leaf number, total leaf area, and leaf re...

teleworking as an innovative way has many benefits in governmental, organizational and individual levels, but it faced with different variables in plan and implementation which is caused to low acceptance rate in organizations. by identifying and controlling these variables, managers and decision-makers can use teleworking programs in their organizations. the aim of this study is to investigate...

The ability to respond timely and cost effectively is bringing rapid manufacturing techniques into the mainstream production/repair arena. The Army can benefit from such technologies to avoid long lead times and high costs of procuring and inventorying replacement parts. But, a technology that offers versatility in terms of product size, cost and the ability to fabricate production components r...

Thermal conductivity of superconducting MgB 2 was studied in both the superconducting and the normal state region. The latter is almost equally determined by the electronic-and the lattice contribution to the total thermal conductivity. In the superconducting state, however, the lattice contribution is larger. The electronic thermal conductivity below T c was derived from the experimental data ...

The boosting of consumer electronics and 5G technology cause the continuous increment power density electronic devices lead to inevitable overheating problems, which reduces operation efficiency shortens service life devices. Therefore, it is primary task a prerequisite explore innovative material for meeting requirement high heat dissipation performance. In comparison with traditional thermal ...