Thermal tomography refers to the acquisition of detailed thermal information throughout a slice of the subject. Experimental temperature information of this nature to be obtained experimentally using some form of scanning mechanism is usually implied by the term, noninvasive thermometry. Desirable specifications for such a system are presented, and the degree to which the proposed methods are l...

The heat flow and physical properties package measured soil thermal conductivity at the landing site in 0.03–0.37 m depth range. Six measurements spanning solar longitudes from 8.0° to 210.0° were made atmospheric pressure was simultaneously using InSight's Pressure Sensor. We find that strongly correlates with pressure. This trend is compatible predictions of dependence for unconsolidated soil...

According to theoretical predictions, endothermic homeotherms can be classified as either thermal specialists or thermal generalists. In high cost environments, thermal specialists are supposed to be more prone to using facultative heterothermy than generalists. We tested this hypothesis at the intraspecific level using male laboratory mice (C57BL/cmdb) fasted under different thermal conditions...

Space structures are subjected to appreciable temperature variations when they enter and leave direct solar radiation zones. These variations cause thermal strains and related structural distortions. Such deformations are often a nuisance and much engineering e ort, such as active control methods, is currently being invested in reducing the deformations and alleviating their e ects. This paper ...

Electronic power devices used for transportation applications (automotive and avionics) experience severe temperature variations, which promote their thermal fatigue and failure. For example, for power modules mounted on the engine of an aircraft, temperature variations range from –55°C (in the worst case of storage before takeoff) to +200°C (flight). Direct bonded copper (DBC) substrates are u...

The thermal resistance of the attachment between a die and its carrier contributes strongly to the total temperature rise in an electronic system. The die attach resistance often differs substantially from the value predicted using the bulk thermal conductivity of the attachment material because of partial voiding and delamination. These defects can be introduced during the attachment process o...

We simulate the effects of an intrinsically dense boundary layer at the base of the mantle on the thermal structure of D and the dynamics of the lower mantle. Using a finite element model of thermo-chemical convection in 2-D with a Rayleigh number of 10, we investigate the dynamic consequences of varying the density and of increasing thermal diffusivity in the basal layer to simulate enrichment...

Oxygen nonstoichiometry, electrical conductivity and thermal expansion of La2-xSrxNiO4- phases with high levels of strontium substitution (1 ≤ x ≤ 1.4) have been investigated in air and oxygen atmosphere in the temperature range 20-1050 °C. These phases retain the K2NiF4-type structure of La2NiO4 (tetragonal, space group I4/mmm). The oxygen vacancy fraction was determined independently from th...