This paper focuses on electroplating-based volumetric nanomanufacturing to create highly-structured multilayer metallic materials, with precisely designed characteristic lengths in the hundreds of nanometers but volumes of manufactured material in the macro range. This electroplating-based approach also enables batch fabrication of nanostructures. The fabrication relies on automated and repeate...

The demand for palladium (Pd) has increased and this made it necessary to recover pure Pd from diverse secondary resources. To the small amount of Pd(II) present in spent electroplating solutions, is concentrated by cementation with zinc metal. In work, a hydrometallurgical process consisting leaching solvent extraction was developed cemented Pd. behavior Zn(II) synthetic HCl solution commercia...

Nickel thin films have been electrodeposited without the use of an additional seed layer, on highly doped silicon wafers. These substrates conduct sufficiently well to allow deposition using a peripherical electrical contact on the wafer. Films 2 μm thick have been deposited using a nickel sulfamate bath on both n+and p+-type silicon wafers, where a series of trenches with different widths had ...

Electroplating remains an attractive deposition approach for fabricating metal microspherical targets inertial confinement fusion because of its relatively fast rates and ability to produce full-density small grain coatings. Here, we discuss recent advances that allow coating thick (>60 µm) leak-free gold capsules with gradients silver. We present a new apparatus used electroplating hollow (typ...

Implantable microelectrode arrays (MEAs) have been a boon for neural stimulation and recording experiments. Commercially available MEAs have high impedances, due to their low surface area and small tip diameters, which are suitable for recording single unit activity. Lowering the electrode impedance, but preserving the small diameter, would provide a number of advantages, including reduced stim...