نتایج جستجو برای: خمیرکاغذ cmp

تعداد نتایج: 2840  

Journal: :Applied sciences 2021

Chemical mechanical planarization (CMP) is a technology widely employed in device integration and processes used semiconductor fabrication. In CMP, the polishing pad plays key role both mechanically chemically. The surface of pad, consisting asperities pores, undergoes repeated cycles glazing induced by followed recovery roughness conditioning process applied during CMP. As polymer material, al...

2013
F Angelini V Pacciani S Corrente E Monteferrario ML Romiti R Silenzi V Moschese L Chini

Background Cow’s milk protein (CMP) allergy (CMPA) affects 2-6% of children. The most important allergens are a-casein (ACA), a-lactoalbumin (ALA) and b-lactoglobulin (BLG). BLG, absent in human milk, is considered to be the major allergen of CMP. Little is known about T cells response and cytokines profile in relation to CMPA and tolerance acquisition. Our aim was to characterize T cells respo...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه علوم کشاورزی و منابع طبیعی گرگان - دانشکده جنگلداری و مهندسی چوب و کاغذ 1389

این تحقیق به منظور بررسی تأثیر پیش استخراج بر تولید خمیرکاغذ سودا-آنتراکینون ساقه کنف انجام گرفته است. تیمار پیش استخراج با آب داغ خالص و نیز کاتالیز شده با اسید و قلیا با هدف کاهش وزن در محدوده 5/8، 5/11 و 5/14 درصد براساس وزن خشک خرده های کنف انجام شد. خرده های کنف پیش استخراج شده و پیش تیمار نشده (شاهد) با استفاده از روش سودا- آنتراکینون تبدیل به خمیرکاغذ شدند. نتایج مرحله پیش استخراج نشان د...

Journal: :Cancer research 1986
P C Chan J K Haseman G A Boorman J Huff A G Manus R H Cardy

The carcinogenicity of 3-chloro-2-methylpropene (CMP), a chemical intermediate and insecticide, was studied because of possible human exposure and because of its structural relationship to vinyl chloride and allyl chloride. CMP in corn oil was administered by gavage to groups of 50 male and 50 female Fischer 344/N rats at 0, 75, or 150 mg/kg body weight and to groups of 50 male and 50 female B6...

Journal: :J. Instruction-Level Parallelism 2004
Romain Dolbeau André Seznec

As the increasing of issue width has diminishing returns with superscalar processor, thread parallelism with a single chip is becoming a reality. In the past few years, both SMT (Simultaneous MultiThreading) and CMP (Chip MultiProcessor) approaches were first investigated by academics and are now implemented by the industry. In some sense, CMP and SMT represent two extreme design points. In thi...

2015
Ji-Yeon Kang Se-Jong Lim Ohsuk Kwon Seung-Goo Lee Ha Hyung Kim Doo-Byoung Oh Roger Chammas

Bacterial α(2,6)-sialyltransferases (STs) from Photobacterium damsela, Photobacterium sp. JT-ISH-224, and P. leiognathi JT-SHIZ-145 were recombinantly expressed in Escherichia coli and their ST activities were compared directly using a galactosylated bi-antennary N-glycan as an acceptor substrate. In all ST reactions, there was an increase of sialylated glycans at shorter reaction times and lat...

2017
Mohana Maddula Nikola Sprigg Philip M Bath Sunil Munshi

PURPOSE Cerebral misery perfusion (CMP) is a condition where cerebral autoregulatory capacity is exhausted, and cerebral blood supply in insufficient to meet metabolic demand. We present an educational review of this important condition, which has a range of clinical manifestations. METHOD A non-systematic review of published literature was undertaken on CMP and major cerebral artery occlusiv...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه علوم کشاورزی و منابع طبیعی گرگان - دانشکده منابع طبیعی گرگان 1394

در رنگ بری متداول با پراکسید هیدروژن از هیدروکسید سدیم به عنوان منبع قلیا استفاده می شود، اما قلیائیت زیاد هیدروکسید سدیم در فاز اول رنگ بری باعث عیوبی همچون تیره شدن قلیایی، کاهش بازده خمیرکاغذ و افزایش اکسیژن خواهی شیمیایی در پساب می شود. یک راه حل برای داشتن قلیائیت کمتر، استفاده از هیدروکسید منیزیم است. لذا در تحقیق حاضر اثر جایگزینی جزئی تا کامل هیدروکسید سدیم توسط هیدروکسید منیزیم به عنوا...

2011
Hong Lei Hu Li Ping Liu

Problem statement: Abrasive is one of key influencing factors on the polished surface quality in Chemical Mechanical Polishing (CMP). Solid abrasives in CMP slurries are easy to cause polishing scratches. It is well known that reducing the hardness of abrasives would improve the polished surface quality. Therefore, the change in structure or shape of the abrasives means a change in polished sur...

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