A new thermosonic flip-chip bonding technology has been developed. It is compatible with wire bonding and eliminates the need of solder bumping on wafers. As a result, this technology could be applied to enhance Senior Design type of courses using flipchip assembly to design, assemble and test innovative systems. The technology will be described with a list of different modules prototyped for m...

This paper describes the development of dentin bonding systems, and describes the current strategies for bonding composite resin materials to dentin. Two main strategies are available--total-etch or self-etch--and each has unique advantages and disadvantages. For each category, simplified systems that reduce the number of application steps are available. Currently, the market is moving towards ...

Silicon-based integrated systems are actively pursued for sensing and imaging applications. A major challenge to realize highly sensitive systems is the integration of electronic, optical, mechanical and fluidic, all on a common platform. Further, the interface quality between the tiny optoelectronic structures and the substrate for alignment and coupling of the signals significantly impacts th...