This study presents a design method for the continuous switching test circuits of power devices. Depending on relationship between rated voltage DC source and device under (DUT), two types are proposed. These comprise cascaded buck-boost (or boost-buck) converter to achieve regeneration. Based analysis circuits, is proposed ensure that any failure does not spread circuit even when DUT fails dur...

Background: An electronic device consists of electronic components attached on a circuit board. Reliability of such a device is limited to fatigue properties of the components as well as of the board. Printed circuit board (PCB) consists of conducting traces and vertical interconnect access (via) out of copper embedded in a composite material. Usually the composite material is fiber reinforced ...

Multilayer ceramic integrated circuit (MCIC) devices using low temperature cofired ceramic (LTCC) technology have advantages in the wireless applications attributed to the unique RF materials’ properties and ease of multilayering leading to high Q RF devices. In this paper, the reliability of MCIC-BGA was evaluated under thermal cycling and mechanical test conditions. Two commercial metal paste...

LSI scaling causes the reliability problem. It is important to analyze the degradation of Negative Bias Temperature Instability(NBTI) in circuit designs. Yield is affected by variations. In the near future, NBTI and variations will decrease reliability on FPGAs fabricated in a nanometer process. In this work, we show the effect of NBTI and variations on 65nm FPGAs. According to our results, cic...