In this paper we introduce our virtual etching as part of MAGDA a CAD system for Micro Electro Mechanical Systems (MEMS). Virtual prototyping visualizations require fast algorithms for visualization that are suitable for interactive design. Modern MEMS simulators do not offer dynamic visualizations for etching. Etching progress is time dependent, typically calculated with Finite Element Analysi...

The effect of packaging on the impact-carrying capacity of micro electro-mechanical systems (MEMS) is investigated, with specific reference to a translational accelerometer. By exploiting the small ratio between the masses of MEMS and package/die (typically 10 3 or less) a decoupled two-scale, finite element approach is adopted: at the package/die length-scale the dynamics of whole device after...

Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly standardized process steps as well as low-cost materials. The proposed capping process is based ...

Impact-Echo (IE) is a nondestructive testing technique for plate like concrete structures. We propose a new sensor concept for air-coupled IE measurements. By using an array of MEMS (micro-electro-mechanical system) microphones, instead of a single receiver, several operational advantages compared to conventional sensing strategies in IE are achieved. The MEMS microphone array sensor is cost ef...

A study about the piezoresistive Micro-Electro-Mechanical Systems (MEMS) cantilever for a chemical sensitive mass based sensor has been carried out to enhance sensor sensitivity. The sensitive region attracts the CO2 molecules there by introducing the stress concentration region (SCR). Three types of SCR geometry designs were first analysed using Intellisuite software to study the effect of str...

We are presenting an overview of MEMS-based (Micro-Electro-Mechanical System) optical switch technology starting from the reflective two-dimensional (2D) and three-dimensional (3D) MEMS implementations. To further increase the speed of the MEMS from these devices, the mirror size needs to be reduced. Small mirror size prevents efficient reflection but favors a diffraction-based approach. Two im...

<p>Cleanroom parameters such as temperature, relative humidity and particle count are vital in maintaining cleanliness. People machines working inside the cleanroom main contributors for sudden changes of separameters. Measurements monitoring these therefore necessary to reduce rejects downtime production micro-electro-mechanical systems (MEMS). This paper presents a method developmentof ...

The geometrical constraints and dimensional tolerances lead to specific design issues of MEMS manipulators for biological applications. target properties become even more important in the case vitro manipulation cells. Several solutions have been proposed literature, however, some related thermal heating microgripper tips electric voltage effects still remain unsolved. This paper reports additi...

Compared to the bulk piezoelectric materials counterpart, thin films (PTFs) possess advantages of smaller size, lower power consumption, better sensitivity, and have broad application in advanced micro-electro-mechanical system (MEMS) devices. However, performance MEMS transducers actuators are largely limited by PTFs properties. In this review, we focus on understanding structure-property rela...

The convergence of Micro Electro Mechanical Systems (MEMS) and optics was, at the end of the last century, a fertile ground for a new breed of technological and scientific achievements. The weightlessness of light has been identified very early as a key advantage for micro-actuator application, giving rise to optical free-space MEMS devices. In parallel to these developments, the past 20 years ...