نتایج جستجو برای: film cooling
تعداد نتایج: 144031 فیلتر نتایج به سال:
Porosity is a major concern in the production of light metal parts. This work aims to identify some of the mechanisms of microporosity formation during the gravity-poured castings of magnesium alloy AE42. Two graphite plate molds and a ceramic cylindrical mold were selected to produce a wide range of cooling rates. Temperature data during cooling was acquired with type K thermocouples at 60 Hz ...
A suspended, planar multistage micro thermoelectric (TE) cooler is designed using thermal network model to cool MEMS devices. Though the planar (two-dimensional) design is compatible with MEMS fabrication, its cooling performance is reduced compared to that of a pyramid (three-dimensional) design, due to a mechanically indispensable thin dielectric substrate (SiO2) and technical limit on TE fil...
Cryogen Spray Cooling (CSC) is an auxiliary procedure that pre-cools the epidermis during Laser Dermatologic Surgery (LDS) to avoid non-specific epidermal thermal damage. During CSC, explosive atomization, inflight evaporation and droplet-substrate interaction affect heat extraction from the substrate. In order to understand the heat transfer mechanism of this complex process, we first study th...
Non-uniform high temperature distribution has become a primary concern in view of VLSI performance and reliability. This problem becomes much severer in the nanometer-scale technologies as the required operating frequency moves into the multi-giga Hertz range. Effective handling of “hot spots” is an important issue. Recently, a cooling technology based on heterostructure integrated thermionic (...
A systematic magnetic force microscopy (MFM) study of domain behavior in thin films of the magnetic topological insulator Sb1.89V0.11Te3 reveals that in the virgin domain state, after zero-field cooling, an equal population of up and down domains occurs. Interestingly, the cooling field dependence of MFM images demonstrates that a small cooling magnetic field (approximately 5–10 Oe) is sufficie...
The multichip module (MCM) that contains the central electronic complex (CEC) of the S/390 G5 system is described in this paper. The glass-ceramic module, topped with six layers of polyimide full-field thin-film wiring for chipto-chip interconnection, represents IBM’s most advanced packaging technology. This MCM provides a large wiring capacity, with 595 meters of routed interconnection; it sup...
Shaped cooling holes have received considerable attention in recent years due to their potential improve heat transfer while minimizing pressure drop. In this study, the effects of lobe-shaped on film performance and turbulent flow characteristics are investigated using large-eddy simulation (LES). The LES approach was validated by comparing calculated effectiveness with experimental data. resu...
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