We have analyzed the effects of immersion gold (i-Au) and electroless nickel (e-Ni) thickness, on the reliability of a semiconductor device which has special constraints on the absolute Ni and Au layer thickness. The electrochemical reactions involved in the deposition of immersion Au over Ni involves a substitution process by which Ni atoms are replaced by Au atoms. We demonstrate that in some...

The elimination of compounds such as lead (Pb) and cadmium (Cd) from electrical and electronic equipment as a result of the Restriction of Hazardous Substances (RoHS) annex of the European Union’s Waste from Electrical and Electronic Equipment (WEEE) Directive 2002/95/EC is rapidly approaching the deadline of July 1, 2006. While the RoHS annex to the WEEE directive specifically refers to restri...

Measurements of microwave attenuation at room temperature and 4.2 K have been performed on some conductors commonly used in receiver input circuits. The reduction in loss on cooling is substantial, particularly for copper and plated gold, both of which showed a factor of 3 loss reduction. Copper passivated with benzotriazole shows the same loss as without passivation. The residual resistivity r...

background: the entrance of toxic compounds into wastewater treatment plants (wwtps) can induce disorder in their biological units. therefore, it is necessary to determine the sources of toxic wastewaters. in this study, the toxicity of the wastewater of 3 metal plating industries was assessed using sequencing batch reactor (sbr) bacteria. methods: to obtain the 1-1000 ml/l concentrations, the ...

Electroless nickel plating is a widely used plating method in many industries. The usability of the coating is, however, restricted by the control problems related to the electroless nickel plating process. To ensure deposit quality, the transcendent properties of electroless nickel deposit should be accurately controlled during plating, which is challenging because of the spontaneous, unstable...